The 3rd International Conference on Advances in Solidification Processes was held in the Rolduc Abbey in the Netherlands a few kilometres away from Aachen. Around 200 scientists from 24 countries come in for the four day meeting. They found a stimulating but also relaxing environment and atmosphere, with beautiful weather and the medieval abbey inviting for walks, discussions, sitting outside and drinking a beer or wine.
The contributions given at the conference reflected recent advances in various topics of solidification processes, ranging from fundamental aspects to applied casting technologies. In 20 oral sessions and a large poster session innovative results of segregation phenomena, microstructure evolution, nucleation and growth, phase formation, polyphase solidification, rapid solidification and welding, casting technology, thermophysics of molten alloys, solidification with forced melt flow and growth of single crystals and superalloys together with innovative diagnostic techniques were presented. Thereby, findings from experiments as well as from numerical modeling on different lengths scales were jointly discussed and contribute to new insight in solidification behaviour.
The papers presented in this open access proceedings cover about half the oral and poster presentations given. They were carefully reviewed as in classical peer reviewed journals by two independent referees and most of them were revised and thus improved according to the reviewers comments. We think that this collection of papers presented at ICASP-3 gives an impression of the excellent contributions made. The papers embrace both the basic and applied aspects of solidification.
We especially wish to express our appreciation for the team around Georg Schmitz and Margret Nienhaus organising this event and giving us their valued advice and support at every stage in preparing the conference. We also thank Lokasenna Lektorat for taking the task of checking all language-associated issues and fixing the papers according to the templates given by IOP Conference Series. We also wish to express our gratitude to the IOP Conference Series
publishers, who were always helpful and patient with us.