Abstract
Scanning Acoustic Microscopy (SAM) is a typical inspection method in the semiconductor IC manufacturing industry. Because the die thickness is a key parameter for SIM card, a new method to measure the internal die thickness of SIM card is proposed with SAM's reflective scanning mode. Using this method the internal die thickness of SIM card can be accurately measured without introducing any damages to SIM card. The thickness model and methodology based on the SAM signals have been established. The model was properly verified and calibrated by two real test cases.
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