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Room temperature photoluminescence lifetime for the near-band-edge emission of epitaxial and ion-implanted GaN on GaN structures

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Published 20 May 2019 © 2019 The Japan Society of Applied Physics
, , Citation Shigefusa F. Chichibu et al 2019 Jpn. J. Appl. Phys. 58 SC0802 DOI 10.7567/1347-4065/ab0d06

1347-4065/58/SC/SC0802

Abstract

For accelerating the development of GaN power-switching devices, current knowledge on the origins and dynamic properties of the major intrinsic nonradiative recombination centers (NRCs) in Mg-doped GaN (GaN:Mg) are reviewed, as lightly to heavily doped p-type planar GaN segments are required but certain compensating defects including NRCs hinder their formation. The results of complementary time-resolved photoluminescence and positron annihilation spectroscopy measurements on the epitaxial and ion-implanted GaN:Mg formed on low dislocation density GaN substrates indicate the following: major intrinsic NRCs are the clusters of Ga vacancies (VGas) and N vacancies (VNs), namely VGa(VN)2 in the epitaxial GaN:Mg and (VGa)3(VN)3 in the ion-implanted GaN:Mg after appropriate thermal annealings. The minimum electron capture-cross-sections of VGa(VN)2 and (VGa)3(VN)3 are commonly the middle of 10−13 cm2 at 300 K, which is approximately four times larger than the hole capture-cross-section of the major intrinsic NRCs in n-type GaN, namely VGaVN divacancies, being 7 × 10−14 cm2.

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1. Introduction

In order to solve the energy crisis problem, the exploitation of high-power electronic devices switchable at high-frequencies is one of the delightful ways of decreasing the total energy consumption. For such devices, GaN is suited1) according to its outstanding characteristics such as the large bandgap energy (3.4 eV), high breakdown field (3.3 MV cm−1),2) and high saturation electron velocity (2.5 × 107 cm · s−1).3) A normally-off GaN-based transistor on a freestanding (FS)-GaN substrate with low specific on-state resistance (1.0 mΩ cm2) and a high off-state breakdown voltage (1.7 kV) has been demonstrated using p-type GaN (p-GaN)/AlGaN/GaN layers overgrown on the V-shaped groove formed over the drift layer.4) Moreover, GaN vertical metal-oxide-semiconductor field-effect-transistors (MOSFETs) capable of large current switching have been explored.57)

Although most of the previous GaN devices have been examined using Mg-doped p-GaN (p-GaN:Mg) epitaxial layers,4) selective-area impurity doping is an indispensable technique from the viewpoint of versatile designing and processing of devices at a low cost. In particular, ion implantation (I/I) with appropriate activation annealing is preferred for fabricating both vertically and laterally current-flowing transistors. In this connection, both heavily and lightly doped p-type layers are crucial, because the former realizes low resistance for contacting and hole-injecting layers while the latter is applicable for forming inversion channels and for electric field spreading as a guard ring.8) However, p-type doping by I/I of Mg has long been difficult,914) partially because donor-type defects introduced by I/I and/or donor impurities such as O or Si that might be diffused from the protective overlayer during the post-implantation annealing13) (PIA) likely compensate holes. Another issue is that only Mg serves as an acceptor in GaN.

Several approaches to avoid the compensation have been examined recently.1519) Reference 16 fabricated p-GaN:Mg by using a shallow, sequential implantation of Mg and H ions to (000$\bar{1}$) N-polar plane of FS-GaN, and demonstrated pn junction diodes with a distinct rectification property. Their explanation was that the use of the (000$\bar{1}$) plane allowed a capping-less PIA because of its high thermal stability, which suppressed unwanted hole compensation. Also, the addition of H was assigned to decrease the formation energy of MgGa acceptors.20) Reference 21 have measured the cathodoluminescence (CL) spectra of those N-polar I/I GaN:Mg samples16) at 10 K, and showed the peak originating from the recombination of excitons bound to a MgGa acceptor (ABEs) at 3.465 eV (Refs. 2224) and the ultraviolet luminescence (UVL) band at around 3.26 eV that originates from a free electron or a shallow donor to a MgGa acceptor transition.22,23) However, they simultaneously observed considerable green luminescence (GL) band at around 2.4 eV, which is routinely observed25,26) in I/I GaN:Mg and has been assigned to a transition involving N vacancies (VNs).25) Similar to their reports,16,20) definitive evidence of p-type conductivity with a reliable hole concentration (p) measurement has not been shown, and the device characteristics containing p-GaN:Mg fabricated using I/I have been reported only recently.15,16,18)

For the reliable fabrication of p-GaN:Mg by I/I, an accurate understanding of I/I induced defects is essential, as such defects likely form trapping levels and/or nonradiative recombination centers (NRCs), both of which decrease p. With respect to point defects in GaN:Mg, Refs. 27,28 have detected vacancy-type defects in p-GaN:Mg homoepitaxial films27) grown by metalorganic vapor phase epitaxy (MOVPE) and I/I GaN:Mg (Refs. 27 and 28) formed on unintentionally doped (UID) homoepitaxial films on Ga-polar (0001) plane of a FS-GaN substrate by means of positron (e+) annihilation spectroscopy (PAS)2736) measurement. They have shown that major vacancy-type defects in the epilayers27) were multiple vacancies consisting of a Ga vacancy (VGa) and two or three VNs, namely VGa(VN)2 or VGa(VN)3,27) while those in the as-implanted GaN:Mg were VGaVN divacancies but they agglomerated into larger vacancy clusters such as (VGa)3(VN)3 after a PIA at 1300 °C.28) Combined with the results of time-resolved photoluminescence (TRPL) measurement, Ref. 37 have assigned VGa(VN)2 [or VGa(VN)3] to the major NRCs in the GaN:Mg epilayer and quantified their electron capture-cross-section (σn) approximately the middle of 10−13 cm2 at 300 K, which was larger than the hole capture cross-section (σp) of the major NRCs in n-type GaN (n-GaN), namely VGaVN,32,34,36) being 7 × 10−14 cm2.37,38) However, because the near-band-edge (NBE) emission has scarcely been observed at 300 K from I/I GaN:Mg for a long time,24,26) neither ${\tau }_{{\rm{PL}}}$ nor ${\sigma }_{{\rm{n}}}$ of (VGa)3(VN)3 has been quantified until recently.39)

In this progress review, the origins and σn of the major intrinsic NRCs in epitaxial and I/I p-GaN:Mg formed on low threading dislocation (TD) density FS-GaN substrates are described, and compared with the major intrinsic NRCs in n-GaN.32,34,36,38) The epitaxial p-GaN:Mg commonly exhibited the NBE and/or UVL emissions at low temperatures and the NBE emission at 300 K irrespective of Mg doping concentration, [Mg]. Accordingly, photoluminescence (PL) lifetimes (${\tau }_{{\rm{PL}}}s$) at 300 K were measurable.37) By contrast, both (0001) Ga-polar26) and (000$\bar{1}$) N-polar16,21) I/I GaN:Mg with the average implantation depths larger than 500 nm have never exhibited the NBE emission at 300 K,26) and the results have hampered quantifying ${\tau }_{{\rm{PL}}}$ or judging the conductivity type. Quite recently, sequential shallow implantation of Mg and H into the (000$\bar{1}$) plane with subsequent capping-less PIA has enabled the formation16) of p-type I/I GaN:Mg. Accordingly, ${\tau }_{{\rm{PL}}}$ and σn of (VGa)3(VN)3 defects were quantified very recently.39) The σn values of VGa(VN)2 and (VGa)3(VN)3 are commonly approximately the middle of 10−13 cm2 at 300 K, which is approximately four times larger than σp of the major intrinsic NRCs (VGaVN) in n-GaN.

2. Experiments and analyses

2.1. Samples

The GaN:Mg epilayers were grown by MOVPE by two suppliers, as shown in Fig. 1(a). From supplier A, approximately 1 to 4-μm-thick GaN:Mg epilayers grown on a 2-μm-thick UID GaN epilayer on a Ga-polar c-plane FS-GaN substrate grown by the hydride vapor phase epitaxy (HVPE) method [Mitsubishi Chemical Corp.(MCC)]40) were provided (sample set A). Potential influences of TDs on the PL properties41) may be minimized, as the TD density was in the range of 106 cm−2.40) The [Mg] values were controlled from 3 × 1016 to 7 × 1019 cm−3, which were quantified by using the secondary-ion mass spectrometry (SIMS). As a control sample, a UID GaN film was prepared. From supplier B, approximately 2-μm-thick GaN:Mg epilayers grown on a 2-μm-thick UID GaN epilayer on the same c-plane FS-GaN (MCC)40) were provided. The [Mg] values were 5 × 1017, 5 × 1018, and 4 × 1019 cm−3 (sample set B). All epilayer samples were thermally annealed at Ta = 700 °C for 30 min in a N2 gas ambient for activating42) the MgGa acceptor.

Fig. 1.

Fig. 1. (Color online) A schematic representation of c-plane Mg-doped GaN on GaN sample structures: (a) Mg-doped Ga-polar GaN epilayers (sample sets A and B),27,37) (b) Mg-implanted Ga-polar GaN,26,28) and (c) sequentially Mg- and H-implanted N-polar or Ga-polar GaN.16,21,39) The FS-GaN substrates were grown by HVPE by MCC and Furukawa, as described in the main text.

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The I/I GaN:Mg samples were supplied from suppliers A and C. At supplier A, the samples were formed on a 4-μm-thick UID GaN film grown on the same Ga-polar FS-GaN (MCC),40) as shown in Fig. 1(b). Mg+ ions were implanted into the UID GaN film with several energies ranging from 20 to 430 keV, in order to form a 500-nm-deep box-type profile with [Mg] of 1 × 1017, 1 × 1018, and 1 × 1019 cm−3. The I/I was carried out at room temperature and followed by the deposition of a 300-nm-thick AlN decomposition shield by a sputtering method. All samples were annealed under various temperatures (Ta) between 1000 and 1300 °C for 5 min with N2 gas at atmospheric pressure. The AlN film was chemically removed after annealing. By supplier C, approximately 100-nm-deep N-polar I/I GaN:Mg of a box-type profile was prepared by implanting Mg and H ions sequentially to the (000$\bar{1}$) plane of an n-type FS-GaN substrate grown by HVPE [Furukawa Denshi Co. Ltd. (Furukawa)] through the 30-nm-thick SiNx film, as shown in Fig. 1(c). The total TD density of the edge and screw components was typically 2 × 106 cm−2, which is low enough to maintain the internal quantum efficiency (ηint) of the NBE emission,41) and almost no structural defects were observed. The concentrations of Mg and H in the constant profile region were [Mg] = 1.4 × 1019 cm−3 and [H] = 2.1 × 1020 cm−3. The PIA was carried out without any protective overlayer at Ta between 800 and 1260 °C for 30 s in a N2 ambient. The details of the sample fabrication process can be found elsewhere.16) For comparison, the following four samples were prepared. One was a control Ga-polar GaN:Mg epilayer ([Mg] = 1.5 × 1019 cm−3) grown by MOVPE on a FS-GaN substrate (manufacturer undisclosed). Another was a Ga-polar edition of the principal sample, namely, an approximately 100-nm-deep Mg- and H-implanted GaN of a box-type profile, which was fabricated on a (0001) FS-GaN (Furukawa). The other two were deep-implantation editions, namely, 710-nm-deep Mg- and H-implanted (0001) and (000$\bar{1}$) FS-GaN (Furukawa).21) These comparative I/I samples were annealed at 1230 °C without any capping layers. After the annealing, the (0001) surface became porous, while the (000$\bar{1}$) surface did not exhibit serious degradation.15)

2.2. Steady-state and time-resolved photoluminescence measurements

Steady-state PL was excited by using the 325.0 nm line of a cw He-Cd laser with the power density of 38 W · cm−2. For understanding the origin and dynamic properties of the major intrinsic NRCs in a direct bandgap semiconductor, the complementary use32,34,3639) of TRPL and PAS measurements is suited, as PAS is sensitive to vacancy-type defects2931) and TRPL quantifies ${\tau }_{{\rm{PL}}}$ of the NBE emission that represents the minority carrier lifetime (${\tau }_{{\rm{minority}}}$). The TRPL measurement was carried out at 300 K using approximately 100 fs pulses of a frequency-tripled (3ω) mode-locked Al2O3:Ti laser (λ = 267 nm), of which the repetition rate was decreased to 8 MHz. The power density was approximately 120 nJ cm−2 (per pulse), where the excited carrier concentration is estimated at a few times 1015 cm−3 when ${\tau }_{{\rm{PL}}}$ is 100 ps. We note that both steady-state PL and TRPL measurements were carried out under weak-excitation conditions to underline the nonradiative recombination processes.36) The spot diameter was 1 mm, and the obtained PL and TRPL signals are most likely composed of various signals from corresponding areas with different concentrations of Shockley-Read-Hall (SRH)-type NRCs (NNRC). The TRPL signal was collected using a synchro-scan streak camera with the temporal resolution better than 1 ps. As shown in Fig. 2, an inverse of ${\tau }_{{\rm{PL}}}$ is the PL decay rate, which is a sum of the radiative and nonradiative recombination rates (${R}_{{\rm{R}}}$ and ${R}_{{\rm{NR}}},$ respectively), expressed by ${\tau }_{PL}^{-1}={\tau }_{R}^{-1}+{\tau }_{NR}^{-1},$ where ${\tau }_{{\rm{R}}}$ and ${\tau }_{{\rm{NR}}}$ are the respective lifetimes. Because ${\tau }_{{\rm{R}}}$ of the NBE emission in a good quality bulk material is a unique value; e.g. approximately 40–50 ns at 300 K for the case of GaN under weak excitation conditions,34,43) ${\tau }_{{\rm{NR}}}$ can be derived from measured ${\tau }_{{\rm{PL}}}.$ Here, ${\tau }_{{\rm{NR}}}$ is governed by the capture coefficient for minority carriers (${C}_{{\rm{minority}}}$) and NNRC under the relationship ${\tau }_{{\rm{NR}}}={({C}_{{\rm{minority}}}\cdot {N}_{{\rm{NRC}}})}^{-1}.$ Here, ${C}_{{\rm{minority}}}$ is assumed to be a product of the minority carrier capture-cross section (σminority) and thermal velocity (${v}_{{\rm{minority}}}=\,\sqrt{3{k}_{{\rm{B}}}T\cdot {m}_{{\rm{minority}}}^{-1}}$), where kB is the Boltzmann constant and ${m}_{{\rm{minority}}}$ is the minority carrier effective mass. In this traditional model, the mean free path is assumed to be limited by NNRC, and the estimated ${\sigma }_{{\rm{minority}}}$ is the minimum limit.

Fig. 2.

Fig. 2. (Color online) (a) Schematic representation of the relationship among the generation of an electron-hole pair or an exciton by a photon $h{\rm{\nu }}$ with the rate G, nonradiative recombination at a SRH-type NRC with the rate RNR (lifetime ${\tau }_{{\rm{NR}}}$), and radiative recombination with the rate RR (lifetime ${\tau }_{{\rm{R}}}$). (b) Schematic model of a NRC capturing minority carriers of a thermal velocity ${v}_{{\rm{minority}}}$ and the capture-cross-section ${\sigma }_{{\rm{minority}}}.$ In the case of n-type GaN, in which minority carriers are holes, ${\tau }_{{\rm{NR}}}$ is expressed by $\tfrac{1}{{v}_{{\rm{p}}}\cdot {\sigma }_{{\rm{p}}}\cdot {N}_{{\rm{NRC}}}}.$ [Modified with permission from Ref. 36, J. Appl. Phys. 123, 161413 (2018). Copyright 2018 AIP Publishing LLC].

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2.3. Monoenergetic positron annihilation spectroscopy measurement

For identifying the origin and quantifying the concentration of the major vacancy-type defects, PAS measuremnt2739) was carried out. A monoenergetic e+ beam line at University of Tsukuba27,28,3134,36,37,39) was used to measure the Doppler broadening spectra of the the annihilating γ-rays of e+ and electrons (e). The low- and high-momentum portions of the spectra were characterized by the S and W parameters,2931,35) respectively, where S reflects the size or concentration of the vacancy-type defects. During the PAS measurement, the samples were illuminated with the same He-Cd laser to supply electrons to neutral or positively charged levels.28) Details of the PAS measurements2933,35) and the analytical procedures27,28) can be found elsewhere. The species and the concentration of major vacancy-type defects were identified and quantified from the S-W relationship2933,35) and the magnitude of S parameter,2933,35) respectively. Reference 35 have evaluated the dynamic range of PAS for a neutral defect like a VGa in n-GaN from the sensitivity of e+ annihilation lifetime to approximately between 1016 and 1019 cm−3, at which implanted e+ are nearly fully delocalized in the defect-free (DF) regions and fully trapped by VGas, respectively. The range may shift toward the lower values when the vacancy is negatively charged.

When ${\tau }_{{\rm{NR}}}$ of the NBE emission is inversely proportional to the concentration of a unique defect, the defect can be assigned to the major NRC.32,34,36,37,39) As a consequence, the capture-cross-section for the minority carriers (${\sigma }_{{\rm{minority}}}$) of the NRCs can be derived3639) from the relationship given in Sect. 2.2. By using this complementary approach described in Sect. 2.2 and 2.3,32,34,36) point-defect complexes containing a VGa,32,34) more precisely VGaVN,33,36) have been identified as the origin of the major SRH-type NRCs in n-GaN, because ${\tau }_{NR}$ decreased with increasing the concentration of VGa-complexes,32,34) more precisely VGaVN concentration ([VGaVN]).36) Accordingly, its hole capture coefficient (${C}_{{\rm{p}}}$) was determined from the relationship between ${\tau }_{{\rm{NR}}}$ and NNRC, ${\tau }_{{\rm{NR}}}={\left({C}_{{\rm{p}}}\cdot {N}_{{\rm{NRC}}}\right)}^{-1},$ and σp was deduced from ${C}_{{\rm{p}}}={\sigma }_{{\rm{p}}}\cdot {v}_{{\rm{p}}},$ where ${v}_{{\rm{p}}}=\,\sqrt{3{k}_{{\rm{B}}}T\cdot {m}_{{\rm{p}}}^{-1}}$ is the hole thermal velocity. These parameters are important, as ηint of the NBE emission is given by ${\eta }_{{\rm{int}}}=\tfrac{{R}_{{\rm{R}}}}{{R}_{{\rm{R}}}+{R}_{{\rm{NR}}}}=\tfrac{1}{1+{\tau }_{{\rm{R}}}/{\tau }_{{\rm{NR}}}}.$ Eventually, ${\tau }_{{\rm{PL}}}$ of the NBE emission is expressed by ${\tau }_{{\rm{PL}}}^{-1}={\tau }_{{\rm{R}}}^{-1}+{\sigma }_{{\rm{p}}}\cdot {v}_{{\rm{p}}}\cdot {N}_{{\rm{NRC}}}.$ In the case of n-GaN, ${\sigma }_{{\rm{p}}}$ of VGaVN approximately 7 × 10−14 cm2 was determined in this way,36,38) where intrinsic ${\tau }_{{\rm{R}}}$ was taken as 40 ns.34,43)

3. Results and discussion

3.1. Mg-doped GaN epitaxial films grown by MOVPE

Both the spectra and decay signals of the NBE PL in sample sets A and B showed principally similar trends with respect to the change in [Mg], as follows. PL spectra at 10 K of UID, GaN:Mg set A, and GaN:Mg set B are shown in Figs. 3(a), 3(b)–3(e), and 3(f)–3(h), respectively, by the upper solid lines. The PL intensity (y-) axis has a unit of count per second (cps), and the spectra can be compared with those at different temperatures or other samples. As shown in Fig. 3(a), the UID GaN film exhibited distinct NBE PL peaks and shoulders originating from the recombination of free excitons (FXs) at 3.478 eV, recombination of excitons bound to a neutral donor (DBEs) at 3.472 eV, and their LO phonon replicas at the energies higher than 3.2 eV. In addition, weak luminescence bands called the blue luminescence (BL) band due to the transition of an electron from a carbon deep donor (CGa) to the valence band (carbon-blue)44) at around 2.9 eV and red luminescence (RL) band25) at around 1.8 eV were detected. By using the first-principles calculations, Ref. 25 have suggested that VNs are the origin of RL band. In this context, the appearance of RL implies higher VN concentration, [VN], in the present UID GaN, because state-of-the-art UID GaN films grown by MOVPE do not exhibit RL but exhibit so-called yellow luminescence (YL) band.22,4549) We note that there are two independent origins of the YL band: one is the transition of an electron in the conduction band (or bound to a shallow donor) to a carbon deep acceptor on a N site (CN)49) and the other is the emission due to the complex of a VGa and a donor impurity such as an oxygen on a N site (ON), VGaON.4648)

Fig. 3.

Fig. 3. (Color online) Steady-state PL spectra of (a) UID and (b)–(e) epitaxial GaN:Mg of supplier A and (f)–(h) epitaxial GaN:Mg of supplier B. All samples were grown by MOVPE on a HVPE Ga-polar GaN substrate. The [Mg] values were (b) 1 × 1017, (c) 1 × 1018, (d) 1 × 1019, (e) 7 × 1019, (f) 5 × 1017, (g) 5 × 1018, and (h) 4 × 1019 cm−3. The PL measurement was carried out at 10 K (top traces) and 300 K (bottom traces). [Modified with permission from Ref. 37, Appl. Phys. Lett. 112, 211901 (2018). Copyright 2018 AIP Publishing LLC].

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The dominant NBE emission at 10 K switched from DBEs in UID to ABEs in GaN:Mg films with [Mg] lower than 5 × 1018 cm−3, as shown in Figs. 3(b)–3(d), 3(f), and 3(g). Simultaneously, UVL band25) appeared in the PL spectra of GaN:Mg films [Figs. 3(b)–3(h)]. Such an observation of the ABEs and UVL indicates the formation of MgGa acceptors. We note that [Mg] of 3 to 4 × 1019 cm−3 is routinely used to obtain a p-GaN hole-injecting layer (p = 1 × 1018 cm−3) in light-emitting devices, and the emergence of a BL band (magnesium-blue)23,50) at around 2.8 eV at 300 K (lower solid lines in Fig. 3) is a fingerprint of p-type conductivity of GaN:Mg epilayers. As can be seen in Fig. 3, most of the PL spectra exhibited a weak RL band.25) The enhanced incorporation of VNs in GaN:Mg films compared to n-GaN is reasonable, as the formation energies (EForm) of VN and VN-MgGa decrease with the lowering Fermi level (EF).25,4547)

Even at 10 K, the integrated spectral NBE emission intensity (INBE) decreased with increasing [Mg] when [Mg] exceeded 1–5 × 1018 cm−3, as shown in Figs. 3(d), 3(e), 3(g), and 3(h). A drastic decrease in INBE was found in the samples with [Mg] > 1019 cm−3, indicating higher ${R}_{{\rm{NR}}}$ compared with UID or less Mg-doped samples. For example, INBE (ABE and UVL) of GaN:Mg with [Mg] of 1 × 1019, 4 × 1019, and 7 × 1019 cm−3 were more than one, two, and three orders of magnitude lower than INBE of UID or less Mg-doped samples, as shown in Figs. 3(d), 3(h), and 3(e), respectively. By using a simplified model described in Refs. 36 and 38, the upper bound of NNRC in them can be estimated, as follows. When the average distance of NRCs is far longer than the exciton Bohr diameter ($2{a}_{{\rm{B}}}$) and excitons do not move at zero carrier temperature, ${\eta }_{{\rm{int}}}$ at 0 K is in principle approximately unity. However, when NNRC exceeds a critical value, ${\eta }_{{\rm{int}}}$ at 0 K becomes no longer unity, because an electron-hole pair or an exciton recombines at the NRCs without diffusion or drift, as depicted in Fig. 4. The probability that a diffusion- or drift-free exciton at 0 K is not captured by NRCs and decays with the radiative recombination gives the maximum ${\eta }_{{\rm{int}}}$ (${\eta }_{{\rm{int}}}^{{\rm{\max }}}$) of the emission, which is defined36,38) by ${\eta }_{{\rm{int}}}^{{\rm{\max }}}=1-\tfrac{4}{3}\pi {a}_{{\rm{B}}}^{3}{N}_{{\rm{NRC}}}.$ Here, ${\eta }_{{\rm{int}}}^{{\rm{\max }}}$ is modeled under the assumption that every NRC within the exciton volume causes the nonradiative recombination. From this simple consideration, the assumption that ${\eta }_{{\rm{int}}}$ is close to unity at 2–4.2 K is not absolutely incorrect when NNRC is lower than approximately the middle of 1016 cm−3 for GaN.36,38) Judging from Fig. 4, NNRC of the present GaN:Mg of low INBE is predicted to be between 1016 and 6 × 1018 cm−3. This concentration range is within the dynamic range of PAS for VGa,35) and agrees with the concentration of unknown donors (or donor-type defects) suggested by Ref. 51 using Hall effect measurements on the epitaxial GaN:Mg films, which were grown on FS-GaN substrates manufactured by the same supplier. Such defects may act as NRCs, as the energy level22,25,4649) lies higher than EF of p-GaN:Mg.

Fig. 4.

Fig. 4. (Color online) Maximum ηint (${\eta }_{{\rm{int}}}^{{\rm{\max }}}$) at 0 K of a diffusion- or drift-free excitonic emission in GaN and AlN estimated as a function of NRC concentration, NNRC. The values are calculated under the assumption that every NRC exists within the exciton volume causes nonradiative recombination, as schematically shown on the right side. We note that the major intrinsic NRCs in n-GaN are VGaVN divacancies. [Modified with permission from Ref. 38, Adv. Mater. 29, 1603644 (2017). Copyright 2017 John Wiley and Sons].

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At 300 K, the PL spectrum of UID GaN exhibited a room-temperature FX peak,52) the BL band,44) and the YL band,22,4549) as shown in Fig. 3(a). A similar spectral feature was observed for the lightly Mg-doped epilayers, as shown in Figs. 3(b), 3(c), and 3(f), in which the UVL band partially overlaps the NBE emission. The GL and RL bands were quenched and almost invisible, and only the weak YL band was observed. The predominant PL peak of GaN:Mg gradually switched from UVL (NBE emission) to BL band and their overall intensity decreased with the increase in [Mg], as shown by the lower solid lines in Figs. 3(b)–3(h).

To correlate INBE and ${\tau }_{{\rm{NR}}},$ PL decay signals for the NBE emissions of GaN:Mg films at 300 K are shown in Fig. 5(a). The spectral integration was carried out at the photon energies () between 3.2 and 3.6 eV, in order to cover all NBE emissions such as excitonic and free to acceptor transitions. The TRPL signals appear to be fitted using a multiple-exponential line shape function. In general, the appearance of multiple decay components at 300 K most likely reflects the fact that several portions of different NNRC, which are away beyond the diffusion length of minority carriers (Lminority), are simultaneously observed36) in the macroarea TRPL measurement. In the present case, however, the signals were sufficiently fitted using a bi-exponential function: I(t) = A1exp(−t/τ1) + A2exp(−t/τ2), where I(t) is the PL intensity at time t, and A1 (A2) and ${\tau }_{1}$ (${\tau }_{2}$) are the pre-exponential constant and the lifetime, respectively, of the fast (slow) decay component. The results are shown by the gray lines superimposed on the experimental data. We note that in these analyses, only the bulk recombination was considered and the surface recombination was not taken into account, as excited carriers may not diffuse out to the surface because Lminority is limited by the average distance between the NRCs, $1/\sqrt[3]{{N}_{{\rm{NRC}}}},$ which is approximately 30 nm in GaN:Mg with NNRC approximately a few times 1016 cm−3, as discussed in the following paragraphs.

Fig. 5.

Fig. 5. (Color online) (a) Spectrally integrated TRPL decay signals measured for the NBE emissions of the UID and p-GaN:Mg films. The spectral integration was carried out at between 3.2 and 3.6 eV, in order to cover all NBE emissions such as excitonic and free to acceptor transitions. The signals are vertically offset for better visibility. The signal denoted by "System" shows the overall system response. The supplier and [Mg] of each sample are given in the figure. The decay curves were fitted using a bi-exponential lineshape function, and the results are shown by gray lines superimposed on the experimental data. (b) Fast component ${\tau }_{1}$ of the TRPL signals in panel (a) as a function of [Mg] for the sample sets A (shorter values) and B (longer values). [Modified with permission from Ref. 37, Appl. Phys. Lett. 112, 211901 (2018). Copyright 2018 AIP Publishing LLC].

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The values of ${\tau }_{1}$ obtained through the fitting, which mainly limits the cw PL intensity under low excitation conditions,36) is used as the representative ${\tau }_{{\rm{PL}}}.$ The ${\tau }_{1}$ values are plotted as a function of [Mg] in Fig. 5(b). As is clearly seen, ${\tau }_{1}$ for set B were approximately an order of magnitude longer than those of set A at the same [Mg], and [Mg] at which ${\tau }_{1}$ started to decrease rapidly for set B (approximately 1019 cm−3) was higher than that of A (approximately 1018 cm−3). This result indicates higher ${R}_{{\rm{NR}}}$ at the same [Mg] for set A. As shown in Fig. 3(a), the NBE emission intensity of UID GaN at 300 K was more than three orders of magnitude lower than that at 10 K, and this thermal quenching is severer than the state-of-the-art UID GaN on GaN structures. Therefore, the sample set A appears to contain higher concentration NRCs or different species of NRCs having larger ${\sigma }_{{\rm{n}}}.$ As discussed above, the sample set A likely contains higher concentration VNs. These results are consistent, because VN is one of the constituent elements of NRCs in both n-GaN (Refs. 32,34,36) and p-GaN (Refs. 37 and 39). Nevertheless, the decrease in INBE at 10 K and ${\tau }_{1}$ at 300 K simultaneously occurred for high [Mg] samples.

The S parameters of the GaN:Mg films with [Mg] less than 5 × 1018 cm−3 were almost equal to the characteristic S for the annihilation of e+ and e in DF states (Sfree) being 0.440. However, S increased to approximately 0.442–0.443 for [Mg] higher than 5 × 1018 cm−3, indicating the increased defect concentration. By using the PAS technique, Ref. 27 have studied the vacancy-type defects in GaN:Mg homoepitaxial films grown using MOVPE by supplier A. They have concluded that the GaN:Mg film with [Mg] = 4 × 1019 cm−3 contained multiple vacancies such as VGa(VN)2 [or VGa(VN)3] before and after thermal annealing. From S parameters, the concentrations of VGa(VN)2 [or VGa(VN)3] in the present GaN:Mg films of [Mg] = 5 × 1018, 1 × 1019, and 4 × 1019 are estimated at approximately 7.0 × 1015, 7.0 × 1015, and 2.3 × 1016 cm−3, respectively. Because the decrease in ${\tau }_{{\rm{NR}}}$ synchronized with the increase in [VGa(VN)2], we attribute VGa(VN)2 to the origin of major NRCs in the homoepitaxial p-GaN:Mg films.

The relationship between ${\tau }_{{\rm{PL}}}$ at 300 K and NNRC of GaN:Mg epilayers is shown by closed squares in Fig. 6, where the right y-axis shows corresponding ${\eta }_{{\rm{int}}}$ using ${\tau }_{{\rm{R}}}$ = 40 ns.34,43) In Fig. 6, four ideal curves are drawn for the cases with ${\sigma }_{{\rm{n}}}$ ranging from 1 × 10−12 to 1 × 10−15 cm2 using the relationship ${\tau }_{{\rm{PL}}}^{-1}={\tau }_{{\rm{R}}}^{-1}+{\sigma }_{{\rm{n}}}\cdot {v}_{{\rm{n}}}\cdot {N}_{{\rm{NRC}}},$ where ${v}_{{\rm{n}}}=2.6\times {10}^{7}$ cm s−1 and the electron effective mass mn = 0.20m0 (m0 is a free electron mass). This relationship predicts that ${\tau }_{{\rm{PL}}}$-NNRC shows a straight line under low excitation and high NNRC conditions, where ${\tau }_{{\rm{NR}}}$ dominates ${\tau }_{{\rm{PL}}}.$ As shown, the data points are scattered around the lines for ${\sigma }_{{\rm{n}}}$ = 10−13 and 10−12 cm2. This large error likely originates from two reasons. One is the fact that [VGa(VN)2] are close to the detection limit of PAS being 1015 cm−3, where the change in S with the change in corresponding NNRC ($\tfrac{\partial S}{\partial {N}_{{\rm{NRC}}}}$) is much smller than that at the middle of the dynamic range.29,31,35) Another is that set A contains another type of defect. Taking the data for sample set B, ${\sigma }_{{\rm{n}}}$ of VGa(VN)2 is determined at the middle of 10−13 cm2, which is approximately four times larger than ${\sigma }_{{\rm{p}}}$ of VGaVN in n-GaN being 7 × 10−14 cm2 (Refs. 36 and 38). Combined with the large ${v}_{{\rm{n}}},$ ${\tau }_{{\rm{minority}}}$ in p-GaN:Mg becomes much shorter than that in n-GaN.

Fig. 6.

Fig. 6. (Color online) PL lifetime ${\tau }_{{\rm{PL}}}$ and corresponding ηint of the NBE emission in p-type GaN:Mg at 300 K as a function of NNRC. The major NRCs are VGa(VN)2 in p-GaN:Mg epilayers and (VGa)3(VN)3 in I/I p-GaN:Mg. The experimental data for the epitaxial p-GaN:Mg are shown by closed squares (red for the supplier A and blue for the supplier B online) and those for the 100-nm-deep N-polar I/I-GaN:Mg ([Mg]=1 × 1019 cm−3) annealed at 800, 1000, 1100, and 1230 °C are shown by closed circles. Four ideal ${\tau }_{{\rm{PL}}}-{N}_{{\rm{NRC}}}$ curves are drawn for ${\sigma }_{{\rm{n}}}$ ranging from 1 × 10−15 to 1 × 10−12 cm2 as a guide to the eye. As the temporal resolution of our TRPL system is better than 1 ps and the dynamic range of the present PAS measurement is between the middles of 1015 and 1018 cm−3, the data points in the shaded zone are reliable. All samples appear to have nearly similar ${\sigma }_{{\rm{n}}}$ being the middle of 10−13 cm2, as shown by the broken line. [Modified with permission from Ref. 39, Appl. Phys. Lett. 113, 191901 (2018). Copyright 2018 AIP Publishing LLC].

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3.2. Mg-implanted Ga-polar GaN (500-nm-deep box-type profiles)

The Mg implantation drastically modified the electronic properties of GaN, which is characterized by the appearance of undiminishable GL band, as follows. Changes in the PL spectra of I/I GaN:Mg are summarized as functions of Ta (column) and [Mg] (row) using a matrix in Fig. 7. In each panel, PL spectra measured at 10 and 300 K are shown at the top and bottom, respectively. The top traces in the right edge column of Fig. 7, namely Figs. 7(d), 7(h), and 7(l), show the low-temperature PL spectra of I/I GaN:Mg for [Mg] = 1 × 1017, 1 × 1018, and 1 × 1019 cm−3, respectively, after PIA at 1300 °C. All samples exhibited the UVL band, implying the formation of MgGa acceptors.2224,50) However, even at 10 K, the absolute intensities of ABEs and UVL were approximately two orders of magnitude lower than those of GaN:Mg epilayers of comparable [Mg] shown in Figs. 3(b)–3(d). At the same time, the GL band, which has not been found in UID or Mg-doped GaN epilayers, appeared in all I/I GaN:Mg [Figs. 7(a)–7(l)] and eventually GL became the dominant emission in the spectra of the samples with [Mg] of 1 × 1019 cm−3, as shown in the topmost row of Fig. 7, namely Fig. 7(i)–7(l). These results indicate that I/I of Mg generates NRCs and simultaneously increases the concentration of the point defects relevant to GL. Because these two major change occurred simultaneously by I/I, the NRCs and GL most likely have a common26) constituent element, namely VN, of which concentration [VN] is sufficiently low in most of epitaxial GaN:Mg.

Fig. 7.

Fig. 7. (Color online) Steady-state PL spectra of the Ga-polar I/I GaN:Mg after PIA as functions of Ta (column) and [Mg] (row) using a matrix. The Mg I/I was carried out to form a 500-nm-deep box-type profile. The [Mg] value and Ta are indicated in each panel. The PL measurement was carried out at 10 K (top traces) and 300 K (bottom traces). [Reproduced with permission from Ref. 26, Appl. Phys. Express 10, 061002 (2017). Copyright 2017 The Japan Society of Applied Physics].

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Reference 28 examined these samples using PAS measurement and found that I/I of Mg at room temperature generated a very high concentration (VGaVN)s and that they agglomerated into (VGa)3(VN)3 clusters during PIA, although their concentration, [(VGa)3(VN)3], could be decreased by increasing the PIA temperature up to Ta = 1300 °C.28) The S parameters of I/I GaN:Mg after PIA (0.46–0.49)28) were commonly larger than that of epitaxial GaN:Mg of [Mg] = 4 × 1019 cm−3 (0.449)27) or Sfree (0.440). Accordingly, the present I/I GaN:Mg samples contain high concentrations of (VGa)3(VN)3 clusters and positron-insensitive VNs.26) Because (VGa)3(VN)3 defects were quite recently39) assigned to the major SRH-type NRCs in the (000$\bar{1}$) N-polar GaN:Mg (Refs. 16 and 21) formed by the sequential shallow I/I of Mg and H, (VGa)3(VN)3 likely act as NRCs in these (0001) Ga-polar editions26,28) in Fig. 7.

The room-temperature PL spectra of epitaxial and I/I GaN:Mg also showed clear differences, as shown by the bottom lines in Figs. 3 and 7. In principle, I/I GaN:Mg did not exhibit the NBE or UVL peak, as shown in Fig. 7, except for the detectable NBE peaks in Figs. 7(b) and 7(c) for the lowest [Mg] sample. Such low quantum efficiencies of the NBE emission, UVL, and BL are caused by high NNRC. The dominance of the GL band at 300 K in Fig. 7(l) is, therefore, the result of the introduction of VNs by Mg I/I.

For the same Mg dose, the NBE and UVL intensities at 10 K were increased by increasing Ta, implying that high Ta annealing is effective in decreasing NNRC. Then, the increase in GL intensity with increasing Ta in Figs. 7(i)–7(l) is not due to the increase in [VN] but to the increased capture of carriers by (VGa)3(VN)3 owing to the reduced NNRC. Nonetheless, the NBE emission intensity at 300 K of the sample with [Mg] = 1 × 1017 cm−3 was decreased by the increase in Ta to 1300 °C, presumably because of the increase in [VN] by N out-diffusion from the surface and/or the downshift of EF by the activation of Mg. Consequently, the overall I/I process, including PIA, must be optimized to decrease [VN] and [VGa] for the reproducible production of p-type conductivity.

3.3. Sequentially Mg and H implanted N-polar GaN (100-nm-deep box-type profiles)

PL spectra of the control GaN:Mg epilayer annealed at 850 °C, 710-nm-deep Ga- and N-polar I/I-GaN:Mg annealed at 1230 °C, and 100-nm-deep Ga- and N-polar I/I-GaN:Mg annealed at 1230 °C are shown in Figs. 8(a)–8(e), respectively. The [Mg] values were commonly 1 × 1019 cm−3. In Figs. 8(f)–8(j), the PL spectra of as-implanted and annealed 100-nm-deep N-polar I/I-GaN:Mg of Ta = 800, 1000, 1100, and 1260 °C are shown, respectively. In each panel, PL spectra measured at 10 and 300 K are shown at the top and bottom, respectively. As shown in Fig. 8(a), the Ga-polar GaN:Mg epilayer after annealing exhibited the UVL band and ABE peak at 10 K, both of which are associated with MgGa acceptors.2224,50) The emissions from deep energy states such as GL or RL were absent. These spectral features agree with those shown in Fig. 3(d). The 710-nm-deep Ga- and N-polar I/I-GaN:Mg also exhibited the UVL band at 10 K, as shown in Figs. 8(b) and 8(c), respectively, implying the formation of MgGa acceptors.2224,50) However, their intensities were three orders of magnitude lower than the epilayer [Figs. 3(d) and 8(a)]. Moreover, the distinct GL band peculiar to I/I GaN:Mg (Refs. 21 and 26) was dominant and the RL band with almost equal intensity as UVL was found in both spectra. In contrast, the 100-nm-deep Ga- and N-polar I/I-GaN:Mg exhibited a distinct UVL band at 10 K, of which intensities were approximately one and two orders of magnitude higher than the 710-nm-deep ones, as shown in Figs. 8(d) and 8(e), respectively. In addition, a distinct ABE peak was found only in the 100-nm-deep samples, where both GL and RL were significantly suppressed. Therefore, the depth of I/I, i e., total doses and energies used, seriously affected PL intensities.21) To form constant [Mg] and [H] profiles, higher total doses and a greater number of times of I/I with higher energies are required for deeper profile samples, meaning that the samples suffer from severer I/I damage.21)

Fig. 8.

Fig. 8. (Color online) Steady-state PL spectra at 10 K (top traces) and 300 K (bottom traces) of (a) Ga-polar GaN:Mg epilayer, 710-nm-deep (b) Ga-polar and (c) N-polar, and 100-nm-deep (d) Ga-polar and (e) N-polar I/I-GaN:Mg annealed at Ta = 1230 °C. (e)-(j) PL spectra of the 100-nm-deep N-polar I/I-GaN:Mg. The Ga-polar epilayer displayed in panel (a) was annealed at 850 °C for 5 min in a N2 ambient. The Ta values were (e) 1230 °C, (g) 800 °C, (h) 1000 °C, (i) 1100 °C, and (j) 1260 °C. The [Mg] values were (a) 1.5 × 1019 cm−3 and (b)–(j) 1.0 × 1019 cm−3. All samples were fabricated on FS-GaN substrates. The PL intensity (y-) axis has a unit of count per second (cps), and all spectra can be quantitatively compared. [Reproduced with permission from Ref. 39, Appl. Phys. Lett. 113, 191901 (2018). Copyright 2018 AIP Publishing LLC].

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At 300 K, the dominant PL peak of the control GaN:Mg epilayer was the BL band,23,50) as shown in Fig. 8(a). Although the 710-nm-deep Ga- and N-polar I/I-GaN:Mg did not exhibit any NBE emissions at 300 K, as shown in Figs. 8(b) and 8(c), respectively, the 100-nm-deep samples did, as shown in Figs. 8(d) and 8(e). These results again indicate lower NNRC in the 100-nm-deep samples. Because the NBE emission intensity at 300 K of the 100-nm-deep N-polar I/I-GaN:Mg [Fig. 8(e)] was an order of magnitude higher than the Ga-polar edition [Fig. 8(d)], NNRC in the N-polar one is likely lower than the Ga-polar one, provided that the major NRCs in both samples have a common origin. Reference 39 carried out PAS analyses of the present samples and concluded from the S-W relationship that major defect species in the N-polar I/I-GaN:Mg after PIA at Ta = 1000 °C was the same as that in the Ga-polar one,28) namely, (VGa)3(VN)3. Accordingly, if (VGa)3(VN)3 are the common major NRCs in Ga- and N-polar I/I-GaN:Mg, above hypothesis is correct. In addition to the NBE emission, the 100-nm-deep N-polar I/I-GaN:Mg exhibited the distinct BL band as the low energy tail of UVL at 300 K, as shown in Fig. 8(e). Here we mention that the major NRCs and their concentrations in these Ga- and N-polar GaN:Mg samples before I/I were commonly VGaVN (Refs. 32,34, and 36) and lower than the dynamic range of the PAS measurement (<1016 cm−3),34) respectively, because the sequential I/I was carried out on (0001) and (000$\bar{1}$) planes of an n-type FS-GaN substrate.21) Therefore, in addition to the depth of I/I, the crystallographic plane used for I/I is the other considerable factor affecting the PL intensities. As already mentioned, the (000$\bar{1}$) plane offers better thermal stability than (0001) plane does,16) and therefore, the formation of NRCs at the surface during PIA is less likely. These considerations are consistent with the fact that the 100-nm-deep N-polar I/I-GaN:Mg showed a p-type conductivity.16) However, because the integrated spectral intensity of the NBE emission and BL band at 300 K of the 100-nm-deep N-polar I/I-GaN:Mg was still lower by two orders of magnitude than that of the epilayer, a further decrease in NNRC and the concentration of the defects responsible for GL (VN) is mandatory. We note that Ref. 53 very recently showed that the sequential I/I of Mg and N into the (0001) Ga-polar GaN followed by uncapped PIA in 1 GPa N2 atmosphere at 1480 °C gave rise to the observation of an intense UVL band due to MgGa and suppressed GL band in the low temperature CL spectra. Their results may indicate that I/I of additional N followed by the high pressure and high temperature PIA partially suppress the formation of VN.

As shown in Figs. 8(e)–8(j), PL spectra of the 100-nm-deep N-polar I/I-GaN:Mg after PIA commonly exhibited the YL band.22,4549) Different from the case of MOVPE films that contain carbon impurities higher than the middle of 1015 cm−3 (Ref. 54), the present I/I-GaN:Mg samples formed at the (000$\bar{1}$) surface of the HVPE FS-GaN are likely nearly carbon-free. Therefore, these samples likely contain VGas. Such VGas and VNs likely form the vacancy clusters that act as NRCs, as are the cases with VGaVN in n-GaN32,36) and VGa(VN)2 in the p-GaN:Mg epilayer.37) It is noted from Figs. 8(e)–8(j) that the overall PL intensity, which is a sum of NBE, UVL, BL, GL, YL, and RL intensities, of the 100-nm-deep N-polar I/I-GaN:Mg appears to increase with increasing Ta at both 10 and 300 K. This result implies a progressive decrease in NNRC with increasing Ta.

In order to correlate ${\tau }_{{\rm{NR}}}$ of the NBE emission and NNRC in the 100-nm-deep N-polar I/I-GaN:Mg, the NBE PL decay signals at 300 K are shown in Fig. 9(a) as a function of Ta. As shown, PL decay signals were obtained with a sufficient signal-to-noise ratio and sufficient temporal resolution. As is the case with GaN:Mg epilayer shown in Fig. 5, the TRPL signals were sufficiently fitted using a bi-exponential function. The fitting results are shown by gray lines superimposed on the experimental data in Fig. 9(a), and the values of ${\tau }_{1}$ and ${\tau }_{2}$ are shown as a function of Ta in Fig. 9(b). As shown, the N-polar I/I-GaN:Mg annealed at Ta = 1230 °C exhibited longer ${\tau }_{1}$ and ${\tau }_{2}$ compared with the Ga-polar sample (open legends). This result is consistent with the relationship between the NBE emission intensities, as shown in Figs. 8(d) and 8(e). The TRPL results also indicate that higher Ta has an advantage in obtaining longer ${\tau }_{1}$ and ${\tau }_{2}.$ As the fast component (${\tau }_{1}$) essentially limits the cw PL intensity under low excitation conditions, ${\tau }_{1}$ is generally used as the representative of ${\tau }_{{\rm{PL}}}.$ By increasing Ta, ${\tau }_{1}$ at 300 K was increased to 18 ps at Ta = 1230 °C, which nearly agrees with typical ${\tau }_{{\rm{PL}}}$ being 20 ps of p-GaN:Mg epilayers of the same [Mg] (1 × 1019 cm−3).37) This result is also consistent with the comparable NBE emission intensities for the GaN:Mg epilayer [Fig. 8(a)] and 100-nm-deep N-polar I/I-GaN:Mg [Fig. 8(e)] at 300 K. Because ${\tau }_{2}$ showed stronger dependence on Ta, as shown in Fig. 9(b), the increase in Ta appears to increase the area of low NNRC zones. In Fig. 9(c), ${\tau }_{2}{{\rm{A}}}_{2}/\left({\tau }_{1}{{\rm{A}}}_{1}+{\tau }_{2}{{\rm{A}}}_{2}\right)$ values are plotted as a function of Ta, where ${\tau }_{2}{{\rm{A}}}_{2}/\left({\tau }_{1}{{\rm{A}}}_{1}+{\tau }_{2}{{\rm{A}}}_{2}\right)$ represents the ratio of carriers recombining in the low NNRC zone to the total carriers.

Fig. 9.

Fig. 9. (Color online) (a) PL decay signals at 300 K for the NBE emission of the 100-nm-deep N-polar I/I-GaN:Mg annealed at Ta ranging from 800 °C to 1260 °C. For comparison, the signal for the 100-nm-deep Ga-polar I/I-GaN:Mg annealed at Ta = 1230 °C is shown. The spectral integration was carried out at between 3.2 and 3.6 eV, in order to cover all NBE emissions such as excitonic and free to acceptor transitions. The signal denoted by "System" indicates the overall system response. The decay curves were fitted using a bi-exponential line shape function, and the results are shown by gray lines superimposed on the experimental data. (b) Fast and slow decay components (${\tau }_{1}$ and ${\tau }_{2},$ respectively) as a function of Ta. (c) Fraction of the time-integrated PL intensities arising from the slow decay component, τ2A2/(τ1A1 + τ2A2), as a function of Ta. Closed and open legends in (b) and (c) represent the data for the N- and Ga-polar I/I-GaN:Mg, respectively. [Reproduced with permission from Ref. 39, Appl. Phys. Lett. 113, 191901 (2018). Copyright 2018 AIP Publishing LLC.]

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For quantifying NNRC, identification of the origin of NRCs in I/I-GaN:Mg is mandatory. Reference 39 carried out PAS analyses of the present samples and concluded that the major defect species is (VGa)3(VN)3. By comparing the measured and theoretically calculated27,28) S parameters, [(VGa)3(VN)3] in the 100-nm-deep N-polar I/I-GaN:Mg annealed at 800, 1000, 1100, and 1230 °C were estimated at a few times 1016 cm−3 and decreased with increasing Ta. Because ${\tau }_{{\rm{PL}}}$ increased with decreasing [(VGa)3(VN)3], (VGa)3(VN)3 clusters are eventually assigned to the major NRCs in the present N-polar I/I-GaN:Mg.

The relationship between ${\tau }_{{\rm{PL}}}$ of the NBE emission at 300 K and NNRC = [(VGa)3(VN)3] of the 100-nm-deep N-polar I/I-GaN:Mg is shown by closed circles in Fig. 6. As shown, ${\sigma }_{{\rm{n}}}$ of (VGa)3(VN)3 is estimated at a few times 10−13 cm2, the value being comparable to that obtained37) for VGa(VN)2 in the p-GaN:Mg epilayers,27) as plotted by closed squares. Because ${\sigma }_{{\rm{n}}}$ is a parameter representing the trapping probability of minority carriers, it is reasonable that vacancy clusters of different open volumes have similar ${\sigma }_{{\rm{n}}}.$ Nevertheless, this value is approximately four times larger than ${\sigma }_{{\rm{p}}}$ (=7 × 10−14 cm2) of VGaVN in n-GaN, and therefore, ${\tau }_{{\rm{minority}}}$ in p-GaN:Mg samples are much shorter than that in n-GaN, combined with the large ${v}_{{\rm{minority}}}.$ Very recently (Refs. 55 and 56) independently reported the SRH lifetime (${\tau }_{{\rm{SRH}}}$), which is expressed by ${\tau }_{{\rm{SRH}}}=\sqrt{{\tau }_{{\rm{n}}}{\tau }_{{\rm{p}}}},$ where ${\tau }_{{\rm{n}}}$ and ${\tau }_{{\rm{p}}}$ are the lifetimes of an electron and a hole at the recombination plane in the depletion layer, respectively, in p+n and n+p junctions of GaN as 12 ns (Ref. 55) and 46 ps (Ref. 56), respectively. This difference may reflect the differences in ${v}_{{\rm{minority}}}$ and ${\sigma }_{{\rm{minority}}}$ of the major NRCs. These results3639,55,56) are consistent with each other.

4. Conclusion

Current knowledge on the origins and dynamic properties of the major intrinsic NRCs in the epitaxial and ion-implanted p-type GaN:Mg fabricated on FS-GaN substrates are summarized. The results of complementary TRPL and PAS measurements indicate that the major intrinsic NRCs are the clusters of VGas and VNs, namely VGa(VN)2 in the epitaxial p-GaN:Mg and (VGa)3(VN)3 in the I/I p-GaN:Mg after appropriate PIA. Different from the case of 4H-SiC, atomic structures of the major intrinsic NRCs in the p-type GaN:Mg epilayer and n-type GaN are different: VGa(VN)2 in the former and VGaVN in the latter. The minimum ${\sigma }_{{\rm{n}}}$ values of VGa(VN)2 and (VGa)3(VN)3 are estimated commonly at the middle of 10−13 cm2 at 300 K, which is approximately four times larger than ${\sigma }_{{\rm{p}}}$ of VGaVN in n-GaN being 7 × 10−14 cm2. Although GaN:Mg layers formed by I/I deeper than 500 nm never exhibited the NBE, UVL, or BL emission at 300 K, those fabricated by the shallow (∼100 nm) and sequential Mg and H implantation followed by the capping-less high temperature PIA gave rise to the observation of the NBE and BL emissions at 300 K and p-type conductivity. As ${\tau }_{{\rm{PL}}}$ of the best (000$\bar{1}$) I/I-GaN:Mg ([Mg] = 1 × 1019 cm−3) that was annealed at Ta = 1230 °C increased to 18 ps, which nearly agrees with typical ${\tau }_{{\rm{PL}}}$ being 20 ps in (0001) Ga-polar p-GaN:Mg epilayers of the same [Mg], good performance vertically current-flowing GaN transistors using I/I p-GaN:Mg will appear in the market shortly.

Acknowledgments

This work was supported in part by "the Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP)" by NEDO, "Program for research and development of next-generation semiconductor to realize energy-saving society", "Program of Dynamic Alliance for Open Innovation Bridging Human, Environment and Materials", and JSPS KAKENHI (Grant Nos. JP16H06427 and JP17H04809) by MEXT, Japan.

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