Brought to you by:

The Rate of Oxidation of Copper at Room Temperature

and

© 1943 ECS - The Electrochemical Society
, , Citation Addison H. White and Lester H. Germer 1942 Trans. Electrochem. Soc. 81 305 DOI 10.1149/1.3071381

1945-6859/81/1/305

Abstract

Electron diffraction was used to measure the rate of the reaction between copper and pure dry oxygen at room temperature and 20 mm. pressure. The experimental technic is described in detail. The empirical rate of reaction is found to be inversely proportional to () for the time greater than two minutes; the constant is experimentally indistinguishable from zero but must be finite. It is estimated that the local thickness, , in Ångstrom units of the oxide film increases according to the equation: where is measured in minutes and is greater than 2 min. A limiting film thickness of about 50 Å is predicted by this equation.

Export citation and abstract BibTeX RIS

10.1149/1.3071381