Abstract
Two-dimensional (2D) layered materials and heterostructures have garnered significant attention for their exploration of uncharted scientific phenomena and their versatile applications. The customization of van der Waals (vdW) heterostructures heavily relies on their transfer assembly techniques. While traditional dry or wet transfer methods show promise in manipulating 2D materials and heterostructures, challenges such as residues from supporting layers, incomplete substrate etching, embedded bubbles at interfaces, and transfer-induced damages like cracks and wrinkles still pose significant hurdles. In this review, we comprehensively examine the state of transfer technology, identifying the origins of these technical challenges and discussing potential solutions. We specifically focus on strategies developed within the last 3-5 years that aim to address these complex transfer issues, facilitating the integration of 2D materials and heterostructures into existing silicon-based technologies. Finally, we offer perspectives to guide the optimization of each transfer method and inspire future industrial applications of 2D materials.
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