Paper The following article is Open access

Printing Parameter Optimization of Biodegradable PLA Stent Strut Thickness by using Response Surface Methodology (RSM)

, , , , and

Published under licence by IOP Publishing Ltd
, , Citation Amirul Asyraf Azli et al 2020 IOP Conf. Ser.: Mater. Sci. Eng. 864 012154 DOI 10.1088/1757-899X/864/1/012154

1757-899X/864/1/012154

Abstract

This work presents printing parameter optimization of 3D printed biodegradable PLA stent. This study is motivated by a gap in current knowledge in 3D printing of stents identified in an extensive literature review. With the demand of coronary artery stents rising every year, the stent production demands a higher quality, lower cost, faster and economical process. Due to its availability relatively low-cost price and adaptability, PLA has been identified for an ideal material for biodegradable stents. Previously, laser micromachining was widely used for processing coronary stent. The emerging of 3D printing process has gained attention for its low cost, high reliability, simple operation and flexibility has shown potential as promising solutions in stents fabrication. The use of 3D printing for stent manufacturing purpose is newly emerge and not widely reported. Up to now, less research has been conducted on 3D printed PLA coronary artery stents. This work therefore, aims to study the relationship of the 3D printing processing parameter towards stents quality. Strut thickness become the key aspects in stents manufacturing. Processing parameter optimization was performed by using Response Surface Methodology (RSM). Nozzle temperature and printing speed were both effecting the strut thickness formations regardless of printing orientations.

Export citation and abstract BibTeX RIS

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

Please wait… references are loading.