Abstract
Femtosecond laser pulses used in micro-drilling, which allows precise and thermal-damage-free removal of material, has progressed remarkably in recent years to become an essential tool for microhole drilling. Helical drilling is the most common method for processing high-precision microholes. Compared to multi-pulse drilling or circular scanning drilling, it is more convenient to process the requested radius and needed depth hole. The mechanism of interaction between the ultra-fast laser and materials is very complex. Exploring the influence of processing parameters on the drilling process not only helps to guide the actual processing, but also helps our understanding of the mechanism. In this study, laser processing parameters for drilling microholes in three materials are investigated. The influence of processing parameters on hole drilling is analysed, and the relationship between the overlapping rate influence on drilling depth and ablation threshold is explored.
Export citation and abstract BibTeX RIS
Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.