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Paper The following article is Open access

Nanoparticle Deposition During Cu-Water Nanofluid Pool Boiling

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Published under licence by IOP Publishing Ltd
, , Citation L Doretti et al 2017 J. Phys.: Conf. Ser. 923 012004 DOI 10.1088/1742-6596/923/1/012004

1742-6596/923/1/012004

Abstract

The present research activity aims to rigorously investigate nanofluid pool boiling in order to definitively assess this as a technique for controlled nanoparticle coating of surfaces, which can enhance the nucleate boiling performance. This paper presents preliminary nanoparticle deposition results obtained during Cu-water (0.13 wt%) nanofluid pool boiling on a smooth copper surface. The tests were run in an experimental setup designed expressly to study water and nanofluid pool boiling. The square test sample block (27.2 mm × 27.2 mm) is equipped with a rake of four calibrated T-type thermocouples each located in a 13.6-mm deep holes drilled every 5 mm from 1 mm below the top surface. The imposed heat flux and wall superheat can be estimated from measurement of the temperature gradient along the four thermocouples. The samples are characterized by scanning electron microscopy (SEM) to analyse the morphological characteristics of the obtained thin, Cu nanoparticle coating.

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10.1088/1742-6596/923/1/012004