Abstract
Electronic product systems are gradually developing in the direction of miniaturization and high integration, and the post-Moore era has arrived. The boundaries between integrated circuit chips and integrated packaging components are becoming blurred, and a new situation of integration and development has been formed for various system-level applications. Microsystems bring together innovations and breakthroughs in multiple disciplines and technologies, and have been widely used in both military and civilian fields. This article provides an overview of the current status and future development trends of advanced packaging technologies in the field of integrated circuits, focusing on existing advanced packaging technologies, such as wafer-level packaging, 2.5D, 3D, SIP and Chiplet integration, and other advanced packaging technologies. And introduced the application of microsystem technology in the microelectronics industry, military field and other civilian fields. At the end of the article, the microsystem technology is prospected.
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