Temperature Modeling of Reflow Soldering Based on the Heat Transfer Mechanisms

In the production of integrated circuit boards, electronic components need to be automatically welded to the circuit board by a reflow oven. Reflow oven welding is the core process of producing circuit boards, and the centre temperature of the welding area is extremely important to the quality of the final product of electronic components. Based on the experimental data, we establish a non-steady heat conduction model based on Newton's cooling law, and use the method of least squares to determine the dynamic parameters, and finally use the finite difference method (FDM) to solve the models.

Secondly, the reflow oven speed will also have an impact on the product quality. At the same time, a single-objective linear programming model with the maximum furnace speed is established, then the step size is to perform a fine search to solve the problem.