Paper The following article is Open access

Research on Manufacturing Readiness Level Improvement of Hybrid Integrated Circuit Based on Intelligent Manufacturing

, , , and

Published under licence by IOP Publishing Ltd
, , Citation Hailong Zhao et al 2021 J. Phys.: Conf. Ser. 1884 012016 DOI 10.1088/1742-6596/1884/1/012016

1742-6596/1884/1/012016

Abstract

This paper takes Hybrid Integrated Circuit (HIC) as research object, on the basis of fully understanding the concept and connotation, grading requirements and evaluation process of Manufacturing Readiness Level (MRL), aiming at the manufacturing risk factors and its sub factors in MRL, based on intelligent manufacturing technology, several ways to improve MRL of HIC are discussed, including intelligent upgrading of manufacturing equipment, intelligent management system, intelligent warehousing and logistics, intelligent interaction of Internet of Things (IOT), big data analysis and mining.

Export citation and abstract BibTeX RIS

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

Please wait… references are loading.
10.1088/1742-6596/1884/1/012016