Modeling frequency integrating unfolding converter with a semiconductor strain gauge bridge taking into account temperature effect

The article considers development of an algorithm and construction of a simulation model of frequency integrating unfolding converter characteristics for a bridge circuit with semiconductor strain gauges, using the MathCAD software as simulation environment. Construction of a simulation model gives the possibility of joint application of bridge circuits with semiconductor strain gauges and frequency integrating unfolding converters in the development of sensitive elements of sensors for mechanical quantities that able to function at high temperatures. An algorithm for determining components of the output signal frequency error is proposed, taking into account variation in parameters of strain gauges and the effect of high temperature, which will allow revealing influence of the error components on the output signal frequency. As a result, the above mentioned can be used in the development of additional methods and means for temperature compensation, taking into account features of semiconductor strain gauges, and to increase objectivity in the analysis of calculation results applied to converters of mechanical values into frequency.