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Study of Temperature Behaviors for a Pellicle in Extreme-Ultraviolet Lithography: Mesh Structure

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Published 28 November 2013 Copyright (c) 2013 The Japan Society of Applied Physics
, , Citation In-Seon Kim et al 2013 Jpn. J. Appl. Phys. 52 126506 DOI 10.7567/JJAP.52.126506

1347-4065/52/12R/126506

Abstract

We report a theoretical study of the temperature behavior for a mesh structure of a pellicle in extreme-ultraviolet (EUV) lithography. Based on our modified heat transfer model, we calculate the temperature dependence of the pellicle mesh on the mesh materials and the structural parameters. The calculated results show that temperature change of the mesh is much slower than the thin film due to its high heat capacity and its saturation temperature has strong dependence on the material and the ratio of the cross-sectional area of the line to the side-cooling surface area of the mesh. Thermal damage is again minimal for the mesh support as is the case of a thin pellicle film.

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10.7567/JJAP.52.126506