Abstract
This study presents an improved thermal network model of the IGBT module that considers the effects of base plate solder fatigue on the junction temperature of the said module used in wind power converters. First, the coupling thermal structure 3D finite element model of the IGBT module is established based on the structure and material parameters of the module used in the wind power converters of a doubly fed induction generator. The junction temperature of the module is also investigated at different thermal desquamating degrees of the base plate solder. Second, the thermal resistance parameters are determined at different desquamating degrees, and the improved thermal network model that considers the effects of base plate solder fatigue is established. Finally, the two results of the calculation of the junction temperature are compared in different fatigue stages through the improved thermal network model and the 3D finite element model, which testify to the effectiveness of the improved thermal network model.
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