Abstract
Dot-array patterns with a-few-µm period were formed on oxidized-Si substrates by Fresnel diffraction of Ti:sapphire femtosecond laser radiation. Si wafers were coated with thin SiO2 films in order to prevent the surface degradation during laser processing. SiO2 layers with various thicknesses from 0 to 1.2 µm were grown by thermal oxidation, and exposed to several laser conditions. The modified surface morphology and the depth of the dots were characterized, revealing periodic fine patterns of 3-µm depth for 0.2-µm SiO2/Si samples irradiated for 30 s at 130-mJ/cm2 laser fluence.
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