Abstract
The present work reports on progress in the design of modular UHV cluster tool multichamber systems. A wide range of processes has been implemented in the Deposition Process Chambers (DPC's), including rf-PECVD, vhf-PECVD, ECR-PECVD and HWCVD. A wide range of intrinsic and doped amorphous and microcrystalline silicon and silicon alloy materials have been produced and have been used in the fabrication of several types of electronic devices such as solar cells, Light Emitting Devices (LED's), Thin Film Transistors (TFT's), etc. using multichamber systems at several laboratories worldwide.
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