Abstract
The heat regimes for a Cr-Cu surface alloy formedon Cu substrate using liquid-phase mixing of film (Cr)–substrate (Cu) system with a low-energy, high-current electron beam (LEHCEB) have been studied. The calculations allowed to determine the melting thresholds for Cr and Cu and the optimal parameters of LEHCEB for Cr-Cu surface alloy formation. The calculations demonstrated that the melt thickness on the surface after irradiation with LEHCEB in optimal modes is 3-4 μm, and the lifetime ∼1 μs. Mechanism of defect generation in the Cr particles was suggested. Generation is attributed to the action of tensile stresses owing to a large difference between the thermal expansion coefficients of Cr and Cu.
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