Abstract
The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scanning Electron Microscopy combined with Element Energy Dispersive Spectroscopy (EDS) are powerful means for authenticity verification. Comparative analysis results serve as an illustration of cases where various features differences can warn not to let a particular component delivery penetrate the assembly process.
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