In-plane linear displacement bistable microrelay

In this paper we investigate the linear displacement bistable mechanism (LDBM) for use in microrelays. The LDBM, thermal actuators and contacts are integrated to demonstrate a relay design. The performance of the relay is characterized using relay performance metrics, including size (1.92 mm²), contact force (23.4 μN), switching time (340 μs), breakdown voltage (>475 V) and isolation (>235 V). The actuation voltage and current are 11 V and 85 mA, respectively. The ac characteristics, including contact-to-contact crosstalk and ac isolation are also measured. The testing results demonstrate that it is feasible to use the LDBM as a microrelay and that it has potential for use in future applications.