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Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab

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E Skup, M Trimpl, R Yarema and J C Yun

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Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The Flip Chip on Board (FCOB) procedure is an especially attractive packaging method for applications requiring a large number of connections at moderate pitch. This paper reports on the successful demonstration of FCOB assembly based on solder bumps down to 250 μm pitch using a SUSS MA8 mask aligner at Fermilab. The assembly procedure will be described, microscopic cross sections of the connections are shown, and first measurements on the contact resistance are presented.

Keywords

Electronic detector readout concepts (solid-state)

Manufacturing

Detector design and construction technologies and materials

Large detector systems for particle and astroparticle physics

 

E-print Number: 0911.0021

Cited: by |

Refers: to

PACS

85.40.-e Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology

84.30.Sk Pulse and digital circuits

Subjects

Electronics and devices

Dates

Issue 11 (November 2009)

Received 13 November 2009, accepted for publication 13 November 2009

Published 17 November 2009



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