Abstract
Varying the thickness of the Pd layer, the role of the Pd films deposited on the cube-textured Ni-based substrates, was assessed in order to investigate the issues related to substrate oxidation phenomena and their impact on the quality of the buffer layer structures. Using a low temperature annealing, 600 °C, a threshold for the Pd film thickness, beyond which the Pd layer hinders the oxides formation on the substrate, can be defined. When the Pd-Ni interdiffusion is complete, oxide phases of Ni and of Ni-W coexist in the substrate. Besides, at temperatures as high as 800°C, the NiWO4 formation is favoured as the thickness of the Pd layer increases. Despite of these phenomena, development of a buffer layer template suitable for YBCO growth are reported with a thickness for the Pd layer as low as 20 nm.
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