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A three-dimensional photoresist etching simulator for TCAD

Ioannis Karafyllidis

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Cellular Automata have been extensively used as a two-dimensional simulator of the photoresist etching process. This simulator has been verified experimentally for 248 nm photolithography. In this work the Cellular Automata simulator is extended in three dimensions in order to deal with problems arising in 193 nm photolithography and beyond. The three-dimensional simulator is tested using well known etch-rate distribution functions and its results are compared with experimental results found in the literature.


PACS

85.40.Bh Computer-aided design of microcircuits; layout and modeling

81.65.Cf Surface cleaning, etching, patterning

85.40.Hp Lithography, masks and pattern transfer

Subjects

Electronics and devices

Surfaces, interfaces and thin films

Dates

Issue 2 (March 1999)

Received 20 August 1998, accepted for publication 5 January 1999



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