G I Hay et al 2009 Smart Mater. Struct. 18 015015 doi:10.1088/0964-1726/18/1/015015
G I Hay1, D J Southee1, P S A Evans1, D J Harrison1, G B Simpson2 and J Wood1
Show affiliationsThis paper reports progress in the development of strain sensors fabricated using the conductive lithographic film (CLF) printing process. Strain sensitive structures printed via an unmodified offset lithographic printing press using a silver-loaded conductive ink have been deposited concurrently with circuit interconnect, to form an electronic smart packaging system. A system populated with surface mount technology (SMT) components has proven successful in interpreting and logging deformation incidences subjected to a package during testing. It is proposed that with further development such a system could be printed synchronously with packaging graphics using a single printing process to form an integrated time–strain monitoring system.
85.40.Ls Metallization, contacts, interconnects; device isolation
07.07.Df Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing
Issue 1 (January 2009)
Received 6 May 2008, in final form 18 November 2008
Published 15 December 2008
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