W Yu et al 2010 J. Micromech. Microeng. 20 025004 doi:10.1088/0960-1317/20/2/025004
W Yu1, M P Y Desmulliez2, A Drufke2, M Leonard2, R S Dhariwal2, D Flynn2, G Bognár3, A Poppe3, G Horvath3, Z Kohari3 and M Rencz3
Show affiliationsA new manufacturing process and the characterization of high-aspect-ratio metal microchannel plates for microelectronic cooling applications are reported in this article. A nickel-based microchannel cooling plate, with channels of width 20 µm and aspect ratio up to 3.6:1, has been successfully fabricated using a modified UV-LIGA process. Similar metal microstructures, based on electroplated copper, have also been obtained with a width of 15 µm and an aspect ratio of up to 5:1. In both cases, an over-plate technology was used to electroform the metallic microchannel plates in a single manufacturing step. Hydrodynamic and cooling characteristics of the microchannel plates such as flow rate and heat resistance have been measured. A heat transfer coefficient of 511 W m−2 K−1 for a flow rate of 120 l h−1 has been obtained for the 20 µm wide nickel-based microchannel.
47.60.-i Flow phenomena in quasi-one-dimensional systems
Issue 2 (February 2010)
Received 3 September 2009, in final form 20 November 2009
Published 15 December 2009
W Yu et al 2010 J. Micromech. Microeng. 20 025004
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