Zongbo Zhang et al 2010 J. Micromech. Microeng. 20 015036 doi:10.1088/0960-1317/20/1/015036
Thermal assisted ultrasonic bonding of multilayer polymer microfluidic devices
Zongbo Zhang1, Yi Luo2, Xiaodong Wang2, Yingsong Zheng1, Yanguo Zhang1 and Liding Wang2
Show affiliationsA new approach to fabricating multilayer microfluidic devices of poly(methyl methacrylate) (PMMA) was presented. Substrates were preheated to 20–30 °C lower than glass transition temperature (Tg) of the material by a hot plate. Then low-amplitude ultrasonic vibration was employed to generate facial heat at the interface of the PMMA layers. Two crossover micro-separation channel networks and a micro mixer were integrated in a four-layer microfluidic device using this method. The burst pressure of the bonded channel was more than 0.65 MPa. In order to demonstrate the performance of this technique, as many as 12 PMMA layers with micro-channels were successfully bonded together at one time. The average depth loss ratio of micro-channels was 0.6% and the tensile strength was 0.67 MPa. Multilayer poly(ethylene terephthalate) (PET) and cyclo-olefin polymer (COP) substrates were also successfully bonded. This study provided a potential method for constructing complex channel networks for polymer microfluidic devices.
- PACS
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85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
- Subjects
- Dates
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Issue 1 (January 2010)
Received 21 September 2009, in final form 3 November 2009
Published 14 December 2009
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Thermal assisted ultrasonic bonding of multilayer polymer microfluidic devices
Zongbo Zhang et al 2010 J. Micromech. Microeng. 20 015036
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