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Effect of process conditions on the properties of conductive tracks in direct imprinting and sintering of metal nano-powders

Jiseok Lim and Shinill Kang1

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A direct patterning process which uses imprinting and sintering of metal nano-powder to make conductive tracks where sintering was performed during imprinting process was designed. A silicon mold for making conductive tracks was designed and fabricated using photolithography and reactive ion etching (RIE). The effect of process conditions on pattern formation was investigated experimentally. To confirm the feasibility of the direct patterning method as an industrial process, the microstructure and electrical resistivity of the fabricated conductive tracks were analyzed. Various defects were analyzed and based on the analysis, the histories of temperature and pressure were optimized.


PACS

81.16.Nd Nanolithography

81.16.Rf Nanoscale pattern formation

61.43.Gt Powders, porous materials

73.63.-b Electronic transport in nanoscale materials and structures

81.65.Cf Surface cleaning, etching, patterning

Subjects

Surfaces, interfaces and thin films

Condensed matter: structural, mechanical & thermal

Nanoscale science and low-D systems

Dates

Issue 12 (December 2009)

Received 22 May 2009

Published 20 October 2009



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