David L Henann et al 2009 J. Micromech. Microeng. 19 115030 doi:10.1088/0960-1317/19/11/115030
David L Henann, Vikas Srivastava, Hayden K Taylor, Melinda R Hale, David E Hardt and Lallit Anand
Show affiliationsMetallic glasses possess unique mechanical properties which make them attractive materials for fabricating components for a variety of applications. For example, the commercial Zr-based metallic glasses possess high tensile strengths (≈2.0 GPa), good fracture toughnesses (≈10–50 MPa
) and good wear and corrosion resistances. A particularly important characteristic of metallic glasses is their intrinsic homogeneity to the nanoscale because of the absence of grain boundaries. This characteristic, coupled with their unique mechanical properties, makes them ideal materials for fabricating micron-scale components, or high-aspect-ratio micro-patterned surfaces, which may in turn be used as dies for the hot-embossing of polymeric microfluidic devices. In this paper we consider a commercially available Zr-based metallic glass which has a glass transition temperature of Tg ≈ 350 °C and describe the thermoplastic forming of a tool made from this material, which has the (negative) microchannel pattern for a simple microfluidic device. This tool was successfully used to produce the microchannel pattern by micro-hot-embossing of the amorphous polymers poly(methyl methacrylate) (Tg ≈ 115 °C) and Zeonex-690R (Tg ≈ 136 °C) above their glass transition temperatures. The metallic glass tool was found to be very robust, and it was used to produce hundreds of high-fidelity micron-scale embossed patterns without degradation or failure.
81.40.Lm Deformation, plasticity, and creep
64.70.P- Glass transitions of specific systems
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
81.40.Np Fatigue, corrosion fatigue, embrittlement, cracking, fracture, and failure
Surfaces, interfaces and thin films
Issue 11 (November 2009)
Received 21 August 2009, in final form 28 September 2009
Published 19 October 2009
David L Henann et al 2009 J. Micromech. Microeng. 19 115030
Eric R Weeks et al 2007 J. Phys.: Condens. Matter 19 205131
K Kusakabe et al 2009 J. Phys.: Condens. Matter 21 485003
David Ferry et al 2009 J. Phys.: Condens. Matter 21 470301
L A Fenner et al 2009 J. Phys.: Condens. Matter 21 452202
Shang Ming-Sheng and Zhang Zi-Ke 2009 Chinese Phys. Lett. 26 118903
Q Jia et al 2009 J. Phys.: Conf. Ser. 190 012157
A.I. Smolyakov et al 2009 Nucl. Fusion 49 125001
S Saib et al 2007 J. Phys.: Condens. Matter 19 486209
Hajime Tanida et al 2009 J. Phys.: Conf. Ser. 190 012061