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Direct molding of dry adhesives with anisotropic peel strength using an offset lift-off photoresist mold

D Sameoto and C Menon

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We demonstrate for the first time a wafer scale, directly molded anisotropic dry adhesive made of silicone that can be produced in a two-mask process. We demonstrate that the peel strength of this adhesive is dependent on the amount of overhang of a thin flexible cap on the top of each fiber. By precisely placing the center of this cap offset to the center of the supporting post, the peel strength of the adhesive can be altered when pulled off in different directions.


PACS

68.35.Np Adhesion

81.20.Hy Forming; molding, extrusion etc.

68.37.Hk Scanning electron microscopy (SEM) (including EBIC)

Subjects

Surfaces, interfaces and thin films

Condensed matter: structural, mechanical & thermal

Dates

Issue 11 (November 2009)

Received 10 April 2009, in final form 21 July 2009

Published 19 October 2009



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