D Sameoto and C Menon 2009 J. Micromech. Microeng. 19 115026 doi:10.1088/0960-1317/19/11/115026
D Sameoto and C Menon
Show affiliationsWe demonstrate for the first time a wafer scale, directly molded anisotropic dry adhesive made of silicone that can be produced in a two-mask process. We demonstrate that the peel strength of this adhesive is dependent on the amount of overhang of a thin flexible cap on the top of each fiber. By precisely placing the center of this cap offset to the center of the supporting post, the peel strength of the adhesive can be altered when pulled off in different directions.
81.20.Hy Forming; molding, extrusion etc.
68.37.Hk Scanning electron microscopy (SEM) (including EBIC)
Issue 11 (November 2009)
Received 10 April 2009, in final form 21 July 2009
Published 19 October 2009
D Sameoto and C Menon 2009 J. Micromech. Microeng. 19 115026
D Sameoto and C Menon 2009 J. Micromech. Microeng. 19 115002
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