J Steigert et al 2008 J. Micromech. Microeng. 18 095013 doi:10.1088/0960-1317/18/9/095013
J Steigert1, O Brett1, C Müller2, M Strasser1, N Wangler1, H Reinecke2,3, M Daub1 and R Zengerle1,3
Show affiliationsWe present a versatile fabrication process for the precise fabrication of embedded three-dimensional microfluidic structures in SU-8 photoresist. The full-wafer bond process based on a polyester (PET) handling layer enhances the previous low-temperature bonding technology. We achieved an extremely high bond strength of 45 MPa while requiring only small anchoring structures. Small channel structures with an aspect ratio >2 as well as wide membranes with an aspect ratio <0.02 were successfully bonded to realize precisely defined channel structures. Furthermore, the developed process features high yields (>80%) and enables the integration of microelectronics. The flexibility of the fabrication process is presented in two contrary applications. A completely freestanding and transparent SU-8 foil with a thickness of 225 µm featuring embedded 3D microchannels was fabricated. Also, high quality ink-jet dispensers were successfully fabricated whereas the dispenser quality mainly depends on the channel quality.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
Issue 9 (September 2008)
Received 2 June 2008, in final form 16 June 2008
Published 29 July 2008
J Steigert et al 2008 J. Micromech. Microeng. 18 095013
John D Barrow et al 2003 Class. Quantum Grav. 20 L155
Manuel Barros et al 2005 Class. Quantum Grav. 22 489
Robert Lambourne 1997 Phys. Educ. 32 34
X Yang et al 2005 Plasma Sources Sci. Technol. 14 314
Adam J. Burgasser 2007 The Astronomical Journal 134 1330
Nick Siegler et al. 2007 The Astronomical Journal 133 2320
Dagny L. Looper et al. 2007 The Astronomical Journal 134 1162
Kelle L. Cruz et al. 2009 The Astronomical Journal 137 3345
N. Pirzkal et al. 2009 ApJ 695 1591