Bong-Hwan Kim and Jong-Bok Kim 2008 J. Micromech. Microeng. 18 075031 doi:10.1088/0960-1317/18/7/075031
Bong-Hwan Kim1 and Jong-Bok Kim2
Show affiliationsWe have designed and fabricated a micro-electro mechanical system (MEMS) probe card, which is suitable for a manufactured product, to achieve a deflection of 50 µm at a force of 1.5 gram (g) and a probe structure height of 720 µm. The cantilever structure consists of a tip and beam of Ni–Co, a bump of Ni and AuSn solder between them. In order to make the probe card compliant, all moving structures such as the tip, beam and bumps were electroplated with nickel, nickel–cobalt and gold solutions. The fabricated MEMS probe card can endure more than 150 µm overdrive and prevent tip damage from particles owing mainly to its high bump height and enhanced high frequency test, putting capacitors between the driving voltage and ground. Based on our experimental results, the average contact force was approximately 1.41 gram force (gf) at 50 µm of deflection and the total path resistance was less than 5 Ω for all pins, while the leakage current was less than 5 nA.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
Issue 7 (July 2008)
Received 8 April 2008, in final form 15 May 2008
Published 19 June 2008
Bong-Hwan Kim and Jong-Bok Kim 2008 J. Micromech. Microeng. 18 075031
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