H Veladi et al 2008 J. Micromech. Microeng. 18 055033 doi:10.1088/0960-1317/18/5/055033
H Veladi1, R R A Syms2 and H Zou3
Show affiliationsA simple method for increasing the thermal efficiency of shape bimorph electrothermal micro-actuators is proposed, based on a reduction of gas conduction cooling beneath the hot arms by a deep, localized undercut. A single-sided, single-mask SCREAM-type process for fabricating differentially cooled actuators in a bonded silicon-on-insulator material is demonstrated. The process uses deep reactive ion etching and undercut to form suspended parts and isotropic reactive ion etching and lift-off of sacrificial shields to form localized mesas. The advantage of the method is confirmed using folded electrothermal actuators, and an approximate halving of the drive power is demonstrated by variations in the substrate profile in the vicinity of a series of actuators with the same mechanical design.
07.10.Cm Micromechanical devices and systems
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
Issue 5 (May 2008)
Received 10 February 2008, in final form 28 March 2008
Published 21 April 2008
H Veladi et al 2008 J. Micromech. Microeng. 18 055033
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