Phill Gu Jung et al 2008 J. Micromech. Microeng. 18 035017 doi:10.1088/0960-1317/18/3/035017
Phill Gu Jung1, Im Deok Jung2, Sang Min Lee2 and Jong Soo Ko1,2
Show affiliationsA new metal patterning process, called micropatterned metal embedding (MME), that enables micropatterned metal lines to be embedded into polymer substrates for flexible circuit interconnections is introduced and experimentally demonstrated. Aluminum/PMMA double layers that are patterned onto a silicon substrate are directly transferred to the PMMA substrate using a hot embossing process. Thus, the patterned aluminum lines are encapsulated in the PMMA and fully embedded in the PMMA substrate. The pattern transfer can be accomplished as a result of the relatively lower bonding energy at the silicon/PMMA interface compared with that of an aluminum/PMMA interface. An aluminum-embedded PMMA sheet with an area of 45 × 50 mm2 was fabricated to evaluate its applicability. After the bending test of the fabricated prototype, no cracks in the aluminum lines were observed.
Issue 3 (March 2008)
Received 1 August 2007, in final form 7 November 2007
Published 28 January 2008
Phill Gu Jung et al 2008 J. Micromech. Microeng. 18 035017
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