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Stain etching of micro-machined silicon structures

V A Melnikov1, E V Astrova2, T S Perova1 and V Srigengan3

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Grooved silicon structures with deep vertical trenches that can be considered as a reactor prototype for bio and chemical reactions have been subjected to stain etching in a HF + NaNO2 solution. The depth profile of photoluminescence (PL) properties of the micro-porous layer formed under the stain etching has been studied by local excitation. It has been found that different parts of the structures are stain etched differentially: the upper area of the groove side walls and their upper surface are etched with the highest etch rate and possess the most intensive PL. The lower part of the side walls has minimal porous film thickness and the weakest PL, while the light emission from the bottoms of the grooves is higher. The rugged surfaces demonstrate higher PL intensity than the smooth surfaces.


PACS

81.65.Cf Surface cleaning, etching, patterning

78.55.Mb Porous materials

78.66.Db Elemental semiconductors and insulators

85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices

Subjects

Electronics and devices

Condensed matter: electrical, magnetic and optical

Semiconductors

Surfaces, interfaces and thin films

Nanoscale science and low-D systems

Dates

Issue 2 (February 2008)

Received 2 July 2007, in final form 29 November 2007

Published 4 January 2008



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