Chiung-Wen Lin et al 2008 J. Micromech. Microeng. 18 025018 doi:10.1088/0960-1317/18/2/025018
Chiung-Wen Lin1, Chia-Pao Hsu2, Hsueh-An Yang3, Wei Chung Wang1,3 and Weileun Fang1,2
Show affiliationsThis study presents a novel system architecture to implement silicon-on-glass (SOG) MEMS devices on Si–glass compound substrate with embedded silicon vias. Thus, the 3D integration of MEMS devices can be accomplished by means of through-wafer silicon vias. The silicon vias connecting to the pads of devices are embedded inside the Pyrex glass. Parasitic capacitance for both vias and microstructures is decreased and mismatch of coefficient of thermal expansion (CTE) is reduced. In applications, the glass reflow process together with the SOG micromachining processes were employed to implement the presented concept. Successful driving of the resonator through the silicon vias is demonstrated. The wafer-level hermetic packaging can be further achieved by anodic bonding of a Pyrex7740 wafer. Hermeticity of the packaged device performed by helium leak test satisfied MIL-STD-883E. The packaged SOG device is SMT (surface mount technology) compatible and ready for 3D microsystem integration.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
85.30.-z Semiconductor devices
85.40.-e Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology
Issue 2 (February 2008)
Received 23 October 2007, in final form 30 November 2007
Published 4 January 2008
Chiung-Wen Lin et al 2008 J. Micromech. Microeng. 18 025018
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