A patterned polyimide without a residual layer is obtained by imprinting with the assistance of a residual solvent. The effects of the wetting behaviors of the poly-amic acid (PAA) solution coated on various surfaces are examined and the formation of hierarchical patterns without residual layers is demonstrated. polydimethylsiloxane (PDMS) and PEI/PDMS are used as imprinting molds with Si and 300 nm SiO₂/Si as substrates. The results indicate that the various ambits of patterns without a residual layer are formed due to the dewetting phenomena caused by surface tension (Suh 2006 Small 2 832). During imprinting, PDMS with a low surface energy makes the PAA solution flow away from its surface exposing the contact area due to dewetting. Self-organized hierarchical structures are also obtained from this process due to effective dewetting. The present study provides a new approach for fabricating patterns without residual layers and the consequent preparation of hierarchical structures, which is considered to be impossible using the lithographic technique.