J Fang et al 2008 J. Micromech. Microeng. 18 105002 doi:10.1088/0960-1317/18/10/105002
J Fang, J Fu and F Ayazi
Show affiliationsThis paper demonstrates a metal-organic thin-film encapsulation technique based on the photolithography of multiple layers of positive-tone photo-definable polymer. This encapsulation process, performed at low temperatures (<110 °C) in a standard basic developer, leaves no residue. Piezoelectrically-actuated length-extensional bulk acoustic wave resonators were successfully encapsulated for a proof-of-concept demonstration. Blanket metallization can lead to complete sealing, which helps exclude moisture and particles from sensitive MEMS devices such as high frequency resonators, RF filters and inertial transducers.
07.10.Cm Micromechanical devices and systems
85.40.Ls Metallization, contacts, interconnects; device isolation
85.40.Hp Lithography, masks and pattern transfer
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
85.50.-n Dielectric, ferroelectric, and piezoelectric devices
Issue 10 (October 2008)
Received 27 May 2008, in final form 24 July 2008
Published 26 August 2008
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