Samuel Charlot et al 2008 J. Micromech. Microeng. 18 017003 doi:10.1088/0960-1317/18/1/017003
Samuel Charlot, Anne-Marie Gué, Josiane Tasselli, Antoine Marty, Patrick Abgrall and Daniel Estève
Show affiliationsThis paper describes a new technology permitting a hybrid integration of silicon chips in polymer (PDMS and SU8) microfluidic structures. This two-step technology starts with transferring the silicon device onto a rigid substrate (typically PCB) and planarizing it, and then it proceeds with stacking of the polymer-made fluidic network onto the device. The technology is low cost, based on screen printing and lamination, can be applied to treat large surface areas, and is compatible with standard photolithography and vacuum based approaches. We show, as an example, the integration of a thermal sensor inside channels made of PDMS or SU8. The developed structures had no fluid leaks at the Si/polymer interfaces and the electrical circuit was perfectly tightproof.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
07.07.Df Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing
85.40.Hp Lithography, masks and pattern transfer
85.40.Xx Hybrid microelectronics; thick films
Issue 1 (January 2008)
Received 22 February 2007, in final form 3 September 2007
Published 11 December 2007
Samuel Charlot et al 2008 J. Micromech. Microeng. 18 017003
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