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Ink-jet fabrication of electronic components

S M Bidoki1,2, D M Lewis2, M Clark2, A Vakorov3, P A Millner3 and D McGorman4

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Nanosized metallic particles dispersed in a polymeric matrix have been used conventionally as a paste or ink to print electrically active patterns on different substrates. The potential of ink-jet printing in this field is clearly important but the challenge to date has been how to achieve prints of low volume resistivity from the very low viscosity ink required for ink-jet printing. In this study, ink-jet printing techniques were used to directly deposit metallic conductive patterns to produce wiring boards, antennas, electrodes and so forth. In these methods, aqueous solutions of metal salt and reducing agent were ink-jet printed consecutively onto the substrate, where an immediate chemical reduction transformed the metal cations into very fine metallic particles. The best performing reducing agent for ink-jet metal deposition was found to be ascorbic acid at neutral pH. Using this chemistry, nanosized silver patterns, composed of particles in the size range 10–200 nm, were successfully formed using a standard office ink-jet thermal-head printer. Deposited layers of silver with high electrical conductance up to 1.89 × 105 S m−1 and sheet resistance up to 0.5 Ω/squ were printed whilst higher conductivities might be expected using more appropriate devices.


PACS

81.65.Cf Surface cleaning, etching, patterning

85.40.Sz Deposition technology

81.16.Rf Nanoscale pattern formation

85.40.Hp Lithography, masks and pattern transfer

Subjects

Electronics and devices

Surfaces, interfaces and thin films

Nanoscale science and low-D systems

Dates

Issue 5 (May 2007)

Received 31 December 2006, in final form 16 March 2007

Published 12 April 2007



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