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Removal of SU-8 photoresist using buckling-driven delamination assisted with a carbon dioxide snow jet for microfluidics fabrication

Sheng-Chung Yang1,2 and Yu-Cheng Lin1

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A new, environmentally friendly, inexpensive and non-destructive method for removing SU-8 after being an electroplating mold in microfluidic fabrication is demonstrated in this paper. A controllable thermal delaminating method assisted by an efficient high-speed aerosol jet consisting of two major steps, delamination followed by removal by lifting, is presented. Experiments with the thermal process, operated at a rising temperature ΔT of 340 °C for 30 min, were carried out. Four delaminations were observed and the critical buckling stresses were calculated to be 38.98, 35.24, 42.04 and 41.26 MPa, respectively. The results show that these delaminations occurred at a rising temperature ΔT of 290, 260.5, 314.7 and 308.5 °C, respectively. The morphology of the thermal buckling-driven delamination was edge initiated and straight sided. The effects of the carbon dioxide (CO2) snow jet at a distance of 10 mm from the nozzle exit as well as the lift force Fdp, drag force Fd and impact force Fi were determined to be 79 × 10−3 N, 0.625 × 10−3 N and (1.65–4.95) × 10−3 N, respectively. Based on the analysis of the lift, drag and impact forces, the lifting force dominates the effects of the CO2 snow jet and is tens of times larger than the others. The experiments and analyses showed that the best distance for the CO2 snow jet to the nozzle exit was 6–10 mm.


PACS

85.40.Hp Lithography, masks and pattern transfer

85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices

Subjects

Electronics and devices

Nanoscale science and low-D systems

Dates

Issue 12 (December 2007)

Received 6 June 2007, in final form 16 September 2007

Published 26 October 2007



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