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Study of the demolding process—implications for thermal stress, adhesion and friction control

Yuhua Guo, Gang Liu, Yin Xiong and Yangchao Tian

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With the improvements of large-scale parallel replication and automation for hot embossing machines, hot embossing has become not only popular in laboratories but also possible and attractive in industry. Most difficulties in polymer micro-molding are caused by the demolding of molds rather than the filling of them. Due to the lack of accurate analysis tools and simulation tools for demolding, it is difficult to improve the process or give design rules for the molds, which could harm the further applications of hot embossing. This paper gives our studies of the demolding process using LIGA mold inserts. The demolding forces mainly consist of thermal shrinkage stress and adhesive forces. First, a finite elements method (FEM) is applied to analyze thermal stress caused by the shrinkage differences between the mold and polymer using ABAQUS/Standard, and a thermal stress barrier is proposed as an auxiliary structure to protect against the converging stress at the bottom corner of microstructures. Then, regarding the adhesion and friction forces, the nanotribology of PMMA is studied by AFM with nickel and PTFE-coated Si3N4 tips. And based on the measurements, the adhesion and friction forces in a demolding cycle are also simulated by FEM using ABAQUS/Standard. At last Ni-PTFE is recommended as the mold material for achieving a lower surface energy and lower friction force. This work proposes several methods that can optimize the demolding process and introduces some good suggestions for mold tool design.


PACS

81.20.Hy Forming; molding, extrusion etc.

02.70.Dh Finite-element and Galerkin methods

68.35.Gy Mechanical properties; surface strains

68.35.Np Adhesion

81.40.Pq Friction, lubrication, and wear

85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices

Subjects

Computational physics

Electronics and devices

Surfaces, interfaces and thin films

Nanoscale science and low-D systems

Condensed matter: structural, mechanical & thermal

Dates

Issue 1 (January 2007)

Received 29 September 2006, in final form 25 October 2006

Published 24 November 2006



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