Bivragh Majeed et al 2006 J. Micromech. Microeng. 16 1519 doi:10.1088/0960-1317/16/8/012
Bivragh Majeed, Indrajit Paul, Kafil M Razeeb, John Barton and Sean C O'Mathuna
Show affiliationsThis paper investigates the effects of thinning on different properties of silicon test die. Silicon test wafers of different thicknesses (525, 250, 100 and 50 µm) were thinned using a mechanical grinding process. The wafers were diced by using a specialized dicing saw and by a laser to study the effect of singulation. The laser dicing adversely affected the mechanical properties, while the fracture strength and flexibility increased with a reducing die thickness for mechanical grind test die. Fractured dies were macro and microscopically examined indicating different modes of failure depending on the fracture load. The electrical parameters of the test die were investigated and showed no adverse affect on the properties due to the thinning process.
81.40.Np Fatigue, corrosion fatigue, embrittlement, cracking, fracture, and failure
72.80.Cw Elemental semiconductors
81.70.Bt Mechanical testing, impact tests, static and dynamic loads
Condensed matter: electrical, magnetic and optical
Issue 8 (August 2006)
Received 28 February 2006
Published 22 June 2006
Bivragh Majeed et al 2006 J. Micromech. Microeng. 16 1519
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