Hugo Nguyen et al 2006 J. Micromech. Microeng. 16 2369 doi:10.1088/0960-1317/16/11/017
Hugo Nguyen, Johan Bejhed, Johan Köhler and Greger Thornell
Show affiliationsDemonstrated and investigated here is a method to seal microfluidic systems by soldering. As a particularly difficult case of growing importance, the sealing of openings contaminated with paraffin wax was studied. Solder paste, screen printed on a metallized silicon substrate, was melted locally through application of 6.5–10 V to a 5 Ω copper film resistor for a few seconds and was found able to drive an intermediate layer of paraffin away and seal a 0.2 mm diameter circular via by wetting a surrounding copper pad. Although verified to be robust, the process did result in failing seals on excessive heating because of consumption of the pads. Correctly performed, the technique provided a seal at least withstanding a pressure of 8 bar for 8 h at 85 °C.
Issue 11 (November 2006)
Received 15 May 2006, in final form 22 August 2006
Published 18 September 2006
Hugo Nguyen et al 2006 J. Micromech. Microeng. 16 2369
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