Danick Briand et al 2005 J. Micromech. Microeng. 15 1657 doi:10.1088/0960-1317/15/9/007
Danick Briand, Patrick Weber1 and Nicolaas F de Rooij
Show affiliationsThis paper reports on the encapsulation of a piezoresistive silicon/Pyrex liquid flow sensor using metal to glass anodic bonding. The bonding technique allowed integrating robust metallic microfluidic interconnects and eliminating the use of glue and O-rings. The bonding parameters of a silicon/Pyrex/metal triple stack were chosen to minimize the residual stress and to obtain a strong and liquid tight bonding interface. The silicon/Pyrex liquid flow sensor was successfully bonded to metallic plates of Kovar and Alloy 42, on which tubes were fixed and a printed circuit board (PCB) was integrated. A post-bonding annealing procedure was developed to reduce the residual bonding stress. The characteristics of the encapsulated liquid flow sensor, such as the temperature coefficient of sensitivity, fulfilled the specifications. Wafer level packaging using metal to glass anodic bonding was considered to reduce the packaging size and cost.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
84.32.Ff Conductors, resistors (including thermistors, varistors, and photoresistors)
Issue 9 (September 2005)
Received 21 February 2005, in final form 31 May 2005
Published 15 July 2005
Danick Briand et al 2005 J. Micromech. Microeng. 15 1657
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