Jin Tae Kim and Choon-Gi Choi 2005 J. Micromech. Microeng. 15 615 doi:10.1088/0960-1317/15/3/025
Jin Tae Kim and Choon-Gi Choi
Show affiliationsThe importance of having a quality x-ray mask has increased with the development of the DXRL process for fabricating polymer MOEMS devices. However, the conventional absorber structure on thin membrane x-ray masks is too fragile for handless manipulation and for the thermoelastic deformation of the absorber. In addition, the fabrication process is very complex and expensive. To overcome these problems, an absorber embedded x-ray mask was realized using a new fabrication method that incorporates deep reactive ion etching (DRIE) and a thermal oxidation process. With sacrificial oxide removal, the sidewall roughness of the embedded absorber was improved to 6 nm. Compared to other masks, the proposed mask provides easier manipulation and higher absorber membrane contrast without changing the thickness of the gold absorber. Using this absorber embedded x-ray mask, we fabricated polymeric optical components with a surface roughness of 20 nm and a depth of 3 mm.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
42.70.Jk Polymers and organics
85.40.Hp Lithography, masks and pattern transfer
85.60.Bt Optoelectronic device characterization, design, and modeling
81.65.Cf Surface cleaning, etching, patterning
42.82.Cr Fabrication techniques; lithography, pattern transfer
Soft matter, liquids and polymers
Surfaces, interfaces and thin films
Issue 3 (March 2005)
Received 7 October 2004, in final form 12 November 2004
Published 13 January 2005
Jin Tae Kim and Choon-Gi Choi 2005 J. Micromech. Microeng. 15 615
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