Tamara Bechtold et al 2005 J. Micromech. Microeng. 15 R17 doi:10.1088/0960-1317/15/11/R01
Tamara Bechtold, Evgenii B Rudnyi and Jan G Korvink
Show affiliationsAn overview of electro-thermal modeling of microsystems is presented. We consider the most important coupling between thermal and electrical phenomena, and then focus on the industry's central concern, that of Joule heating. A description of different solution approaches for the heat transfer partial differential equation, which constitutes the central part of electro-thermal simulation, is given. We briefly review the analytical solutions and consider further the numerical approaches, which are based on spatial discretization of the thermal domain. Lastly, we describe the final level of approximation, the dynamic compact thermal modeling. We emphasize the formal model order reduction methods, because they directly follow the spatial discretization, and thus preserve the investment into the finite element modeling.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
02.70.Dh Finite-element and Galerkin methods
02.60.Lj Ordinary and partial differential equations; boundary value problems
Issue 11 (November 2005)
Received 30 May 2005, in final form 29 July 2005
Published 17 October 2005
Tamara Bechtold et al 2005 J. Micromech. Microeng. 15 R17
S K Bhattacharya and S -I Chu 1985 J. Phys. B: At. Mol. Phys. 18 L275
level
John B Boffard et al 1996 J. Phys. B: At. Mol. Opt. Phys. 29 L795
Yun Song et al 2000 J. Phys.: Condens. Matter 12 5275
Karsten Danzmann and Albrecht Rüdiger 2003 Class. Quantum Grav. 20 S1
V I Donin et al 2003 J. Phys. D: Appl. Phys. 36 2366
D A Dimitrov and G M Wysin 1998 J. Phys.: Condens. Matter 10 7453
A K Sood et al 1981 J. Phys. C: Solid State Phys. 14 5215
Anthony J Guttmann and Iwan Jensen 2006 J. Phys. A: Math. Gen. 39 3871
Duan Yi-Shi et al 2003 Chinese Phys. Lett. 20 2133