Daniel Sang-Won Park et al 2004 J. Micromech. Microeng. 14 335 doi:10.1088/0960-1317/14/3/004
Daniel Sang-Won Park, Kabseog Kim, Brandon Pillans and Jeong-Bong Lee
Show affiliationsThis paper presents a novel pattern transfer process of LIGA and UV-LIGA MEMS onto CMOS chips using polydimethylsiloxane (PDMS) replication and electroplating-based post-IC integration techniques. An array of cylindrical posts was fabricated by the standard LIGA process and an inverse replica was made using a PDMS replication technique. The replicated PDMS mold was used to transfer the LIGA MEMS onto a CMOS chip using electroplating. For the pattern transfer of UV-LIGA MEMS onto CMOS chips, double-layered circular spiral inductors were fabricated using the UV-LIGA technique as metallic master molds. Inverse replicas of the inductors were built in PDMS as double-layered PDMS electroplating mold (PEM). This PEM was aligned and attached onto the chips, and electroplating was performed to transfer the metallic UV-LIGA MEMS inductors onto the chips. The transferred inductors showed a self-resonant frequency of 7.5 GHz, an inductance of 2.11 nH, and a Q-factor of 78.9 at 0.6 GHz.
85.40.Hp Lithography, masks and pattern transfer
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
Issue 3 (March 2004)
Received 4 September 2003
Published 18 November 2003
Daniel Sang-Won Park et al 2004 J. Micromech. Microeng. 14 335
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