D Nilsson et al 2003 J. Micromech. Microeng. 13 S57 doi:10.1088/0960-1317/13/4/309
D Nilsson, S Jensen and A Menon
Show affiliationsA silicon mold used for structuring polymer microcavities for optical applications is fabricated, using a combination of DRIE (deep reactive ion etching) and anisotropic chemical wet etching with KOH + IPA. For polymer optical microcavities, low surface roughness and vertical sidewalls are often needed. This is achieved by aligning the mold precisely to the [110] direction of a silicon (100) wafer and etching very close to the (110) surfaces using a DRIE Bosch process. The surface roughness of the sidewalls is then removed with a short etch in KOH + IPA. To achieve this, the parameters for DRIE and KOH + IPA etch have been optimized. To reduce stiction between the silicon mold and the polymers used for molding, the mold is coated with a teflon-like material using the DRIE system. Released polymer microstructures characterized with AFM and SEM are also presented.
42.70.Jk Polymers and organics
81.20.Hy Forming; molding, extrusion etc.
85.85.+j Micro- and nano-electromechanical systems (MEMS/NEMS) and devices
42.55.Sa Microcavity and microdisk lasers
42.82.Cr Fabrication techniques; lithography, pattern transfer
Soft matter, liquids and polymers
Surfaces, interfaces and thin films
Optics, quantum optics and lasers
Issue 4 (July 2003)
Received 25 February 2003, in final form 16 April 2003
Published 13 June 2003
D Nilsson et al 2003 J. Micromech. Microeng. 13 S57
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