Mark C Peterman et al 2003 J. Micromech. Microeng. 13 380 doi:10.1088/0960-1317/13/3/305
Mark C Peterman1, Philip Huie2, D M Bloom3 and Harvey A Fishman2
Show affiliationsMicromachining has pushed the limits of photolithography in the vertical direction. We demonstrate a new technique for producing structures in thick photoresists, with excellent contact alignment and high aspect ratios using a standard UV source. In this technique, we exposed the resist from the bottom by defining the mask as part of the substrate. By doing so, we successfully created high aspect ratio and multiple-layer structures. Additionally, the structures have a slight inward taper, a very useful feature for molding. This technique is a new way of thinking about photolithography, allowing novel structures and simplified processing.
Issue 3 (May 2003)
Received 28 October 2002, in final form 23 January 2003
Published 28 February 2003
Mark C Peterman et al 2003 J. Micromech. Microeng. 13 380
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