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Resistive switching characteristics of polymer non-volatile memory devices in a scalable via-hole structure

Tae-Wook Kim, Hyejung Choi, Seung-Hwan Oh, Minseok Jo, Gunuk Wang, Byungjin Cho, Dong-Yu Kim, Hyunsang Hwang and Takhee Lee1

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The resistive switching characteristics of polyfluorene-derivative polymer material in a sub-micron scale via-hole device structure were investigated. The scalable via-hole sub-microstructure was fabricated using an e-beam lithographic technique. The polymer non-volatile memory devices varied in size from 40 × 40 µm2 to 200 × 200 nm2. From the scaling of junction size, the memory mechanism can be attributed to the space–charge-limited current with filamentary conduction. Sub-micron scale polymer memory devices showed excellent resistive switching behaviours such as a large ON/OFF ratio (ION/IOFF~104), excellent device-to-device switching uniformity, good sweep endurance, and good retention times (more than 10 000 s). The successful operation of sub-micron scale memory devices of our polyfluorene-derivative polymer shows promise to fabricate high-density polymer memory devices.


PACS

84.32.Dd Connectors, relays, and switches

73.61.Ph Polymers; organic compounds

81.16.Nd Nanolithography

73.50.Fq High-field and nonlinear effects

Subjects

Soft matter, liquids and polymers

Electronics and devices

Surfaces, interfaces and thin films

Nanoscale science and low-D systems

Dates

Issue 2 (14 January 2009)

Received 5 August 2008, in final form 9 October 2008

Published 9 December 2008



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