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Passivation of pigment-grade TiO2 particles by nanothick atomic layer deposited SiO2 films

David M King1, Xinhua Liang1, Beau B Burton2, M Kamal Akhtar3 and Alan W Weimer1

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Pigment-grade TiO2 particles were passivated using nanothick insulating films fabricated by atomic layer deposition (ALD). Conformal SiO2 and Al2O3 layers were coated onto anatase and rutile powders in a fluidized bed reactor. SiO2 films were deposited using tris-dimethylaminosilane (TDMAS) and H2O2 at 500 °C. Trimethylaluminum and water were used as precursors for Al2O3 ALD at 177 °C. The photocatalytic activity of anatase pigment-grade TiO2 was decreased by 98% after the deposition of 2 nm SiO2 films. H2SO4 digest tests were performed to exhibit the pinhole-free nature of the coatings and the TiO2 digest rate was 40 times faster for uncoated TiO2 than SiO2 coated over a 24 h period. Mass spectrometry was used to monitor reaction progress and allowed for dosing time optimization. These results demonstrate that the TDMAS-H2O2 chemistry can deposit high quality, fully dense SiO2 films on high radius of curvature substrates. Particle ALD is a viable passivation method for pigment-grade TiO2 particles.


PACS

81.65.Rv Passivation

82.80.Ms Mass spectrometry (including SIMS, multiphoton ionization and resonance ionization mass spectrometry, MALDI)

81.15.Gh Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, etc.)

81.15.Ef Vacuum deposition

82.50.Hp Processes caused by visible and UV light

Subjects

Surfaces, interfaces and thin films

Chemical physics and physical chemistry

Dates

Issue 25 (25 June 2008)

Received 2 March 2008, in final form 7 April 2008

Published 15 May 2008



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